Dielectric Polymer Nanocomposites

  • J. Keith┬áNelson

Table of contents

  1. Front Matter
    Pages I-X
  2. F. Bellucci, D. Fabiani, G. C. Montanari, L. Testa
    Pages 31-64
  3. R. Ramprasad, N. Shi, C. Tang
    Pages 133-161
  4. Patricia Irwin, Wei Zhang, Yang Cao, Xiaomei Fang, Daniel Qi Tan
    Pages 163-196
  5. J. C. Fothergill
    Pages 197-228
  6. Toshikatsu Tanaka
    Pages 229-258
  7. L. S. Schadler, X. Wang, J. K. Nelson, H. Hillborg
    Pages 259-284
  8. R. J. Fleming
    Pages 285-319
  9. Enis Tuncer, Isidor Sauers
    Pages 321-338
  10. Back Matter
    Pages 339-368

About this book


Dielectric Polymer Nanocomposites provides the first in-depth discussion of nano-dielectrics, an emerging and fast moving topic in electrical insulation. The book provides an overview of the background, principles and promise of nanodielectrics, as well as a discussion of the processing of nanocomposites. Special considerations are also given to  clay based processes, mechanical, thermal and electric properties and surface properties, as well as erosion resistance. Carbon nanotubes are discussed as a means of creation of nonlinear conductivity. Editor J. Keith Nelson brings together the leading minds in the field, whose contributions to the book also:

  • Discusses the background, principles and importance of nano-dielectric composites
  • Includes complete coverage of nanodielectric composites such as cryogenic applications, high voltage stress grading materials and applications in the capacitor industry
  • Provides detailed coverage on the processing of nanocomposites

Dielectric Polymer Nanocomposites is perfect for academics and researchers working in or interested in learning more about this growing field.




Nanotube carbon nanotubes clay-based materials cryogenic applications dielectrics mechanical and thermal properties modeling nanocomposites nanodielectrics non-linear conductivity physics polymer polymers

Editors and affiliations

  • J. Keith┬áNelson
    • 1
  1. 1.Dept. Electrical, Computer &, Systems EngineeringRensselaer Polytechnic InstituteTroyUSA

Bibliographic information

  • DOI
  • Copyright Information Springer-Verlag US 2010
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-1590-0
  • Online ISBN 978-1-4419-1591-7
  • Buy this book on publisher's site