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RF and Microwave Microelectronics Packaging

  • Ken Kuang
  • Franklin Kim
  • Sean S. Cahill

Table of contents

  1. Front Matter
    Pages i-xvi
  2. Eric A. Sanjuan, Sean S. Cahill
    Pages 25-42
  3. Yiin-Kuen Fuh, Firas Sammoura, Yingqi Jiang, Liwei Lin
    Pages 43-68
  4. Mark P. McGrath, Kunia Aihara, Morgan J. Chen, Cheng Chen, Anh-Vu Pham
    Pages 91-113
  5. Thomas Bartnitzek, William Gautier, Guangwen Qu, Shi Cheng, Afshin Ziaei
    Pages 129-163
  6. Jian Yang, Ziliang Wang
    Pages 189-206
  7. Jiang Guosheng, Ken Kuang, Danny Zhu
    Pages 233-265
  8. Zhang Hao, Cui Song, Liu Junyong
    Pages 267-279
  9. Back Matter
    Pages 281-285

About this book

Introduction

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also:

  • Presents methods and techniques used for measuring and testing of the electronic materials properties.
  • Engages in an in-depth discussion of ceramic materials for RF/MW packaging.
  • Offers numerical simulation methods and techniques used in analysis of electronic devices and materials.
  • Discusses thermal management issues for RF/MW packaging.
  • Creates a RF/Microwave Packaging Roadmap for Portable Devices.

Keywords

3D packaging RF and microwave microelectronics composite material electronic packaging electronics high-frequency electronics material packaging and processing methods simulation thermal management thermal mechanical designs

Editors and affiliations

  • Ken Kuang
    • 1
  • Franklin Kim
    • 2
  • Sean S. Cahill
    • 3
  1. 1.San DiegoU.S.A.
  2. 2.Kyocera America, Inc.San DiegoU.S.A.
  3. 3.BridgeWave Communications Inc.Santa ClaraU.S.A.

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-0984-8
  • Copyright Information Springer-Verlag US 2010
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-0983-1
  • Online ISBN 978-1-4419-0984-8
  • Buy this book on publisher's site