Authors:
- Presents a novel way to combine chip and package design, reducing cross-talk so that VLSI systems can be designed to operate significantly faster
- Provides a comprehensive set of bus cross-talk cancellation techniques, both memoryless and memory-based
- Offers a battery of approaches for a VLSI designer to use, depending on the amount of cross-talk their design can tolerate, and the amount of area overhead they can afford
- Includes supplementary material: sn.pub/extras
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About this book
Deep Sub-Micron (DSM) processes present many changes to Very Large Scale Integration (VLSI) circuit designers. One of the greatest challenges is crosstalk, which becomes significant with shrinking feature sizes of VLSI fabrication processes. The presence of crosstalk greatly limits the speed and increases the power consumption of the IC design.
This book focuses on crosstalk avoidance with bus encoding, one of the techniques that selectively mitigates the impact of crosstalk and improves the speed and power consumption of the bus interconnect. This technique encodes data before transmission over the bus to avoid certain undesirable crosstalk conditions and thereby improve the bus speed and/or energy consumption.
Authors and Affiliations
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Laboratories (MERL), Mitsubishi Electric Research, Cambridge, U.S.A.
Chunjie Duan
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Dept. Electrical & Computer Engineering, Montana State University, Bozeman, U.S.A.
Brock J. LaMeres
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Dept. Electrical & Computer Engineering, Texas A & M University, College Station, U.S.A.
Sunil P. Khatri
Bibliographic Information
Book Title: On and Off-Chip Crosstalk Avoidance in VLSI Design
Authors: Chunjie Duan, Brock J. LaMeres, Sunil P. Khatri
DOI: https://doi.org/10.1007/978-1-4419-0947-3
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag US 2010
Hardcover ISBN: 978-1-4419-0946-6Published: 20 January 2010
Softcover ISBN: 978-1-4899-8327-5Published: 26 November 2014
eBook ISBN: 978-1-4419-0947-3Published: 08 January 2010
Edition Number: 1
Number of Pages: XXIV, 240
Topics: Circuits and Systems, Computer-Aided Engineering (CAD, CAE) and Design