Circuits and Systems for Future Generations of Wireless Communications

  • Aleksandar Tasić
  • Wouter A. Serdijn
  • Lawrence E. Larson
  • Gianluca Setti

Part of the Series on Integrated Circuits and Systems book series (ICIR)

Table of contents

  1. Front Matter
    Pages i-viii
  2. Pages 1-3
  3. Luca Baldini, Danilo Manstretta, Tomaso Erseghe, Nicola Laurenti, Antonio Liscidini, R. Castello
    Pages 27-52
  4. Tommy Tsang, Kuan-Yu Lin, Karim Allidina, Mourad El-Gamal
    Pages 53-83
  5. Yanjie Wang, Ali M. Niknejad, Vincent Gaudet, Kris Iniewski
    Pages 85-119
  6. Junxiong Deng, Lawrence E. Larson
    Pages 121-144
  7. Eric A. M. Klumperink, Xiang Gao, Bram Nauta
    Pages 145-168
  8. Mohammad B. Vahidfar, Omid Shoaei
    Pages 169-202
  9. Yi Ke, Jan Craninkx, Georges Gielen
    Pages 203-221
  10. Pieter Crombez, Jan Craninckx, Michiel Steyaert
    Pages 223-248
  11. Gernot Hueber, Rainer Stuhlberger, Andreas Springer
    Pages 249-270
  12. John Dielissen, Nur Engin, Sergei Sawitzki, Kees van Berkel
    Pages 271-297
  13. Back Matter
    Pages 299-306

About this book


The explosive demand in wireless-capable devices, especially with the proliferation of multiple standards, indicates a great opportunity for adoption of wireless technology at a mass-market level. The communication devices of both today and the future will have not only to allow for a variety of applications, supporting the transfer of characters, audio, graphics, and video data, but they will also have to maintain connection with many other devices rather than with a single base station, in a variety of environments. Moreover, to provide various services from different wireless communication standards with higher capacities and higher data-rates, fully integrated and multifunctional wireless devices will be required.

Multifunctional circuits and systems can be made profitable by a large scale of integration, elimination of external components, reduction of silicon area, and extensive reuse of resources. Integration of (Bi)CMOS transceiver RF front-end and analog baseband circuits with computing CMOS circuits on the same silicon chip further reduces costs of multifunctional mobile devices.

However, as batteries continue to determine the lifetime and size of mobile equipment, further extension of capabilities of wearable and wireless devices will depend critically on the integrated circuits and systems solutions.

The demand for multifunctional and multi-mode wireless-capable devices is accompanied by many significant challenges at system, circuit, and technology levels.

In Circuits and Systems for Future Generations of Wireless Communications circuit and system solutions for multiple communication standards and future generations of wireless communications are discussed.


Adaptive Circuits CMOS Data Converters Long-Term-Evolution Next Generation Mobile Networks Standard Standards Transceiver cognitive radio networks communication filters orthogonal frequency-division multiplexing (OFDM) testing ultra-wideband;

Editors and affiliations

  • Aleksandar Tasić
    • 1
  • Wouter A. Serdijn
    • 2
  • Lawrence E. Larson
    • 3
  • Gianluca Setti
    • 4
    • 5
  1. 1.Qualcomm Inc.San DiegoUSA
  2. 2.Delft University of TechnologyElectronics Research Lab.CD DelftNetherlands
  3. 3.Dept. Electrical & Computer EngineeringUniversity of California San DiegoLa Jolla CAUSA
  4. 4.Dept. Engineering (ENDIF)University of FerraraFerrara
  5. 5.Ad. Research Center on Electronic Systems (ARCES)University of BolognaBolognaItaly

Bibliographic information

  • DOI
  • Copyright Information Springer Netherlands 2009
  • Publisher Name Springer, Dordrecht
  • eBook Packages Engineering
  • Print ISBN 978-1-4020-9918-2
  • Online ISBN 978-1-4020-9917-5
  • Series Print ISSN 1558-9412
  • Buy this book on publisher's site