IUTAM Symposium on Mesoscopic Dynamics of Fracture Process and Materials Strength

Proceedings of the IUTAM Symposium held in Osaka, Japan, 6–11 July 2003

  • H. Kitagawa
  • Y. Shibutani
Conference proceedings

Part of the Solid Mechanics and its Applications book series (SMIA, volume 115)

Table of contents

  1. Front Matter
    Pages i-xxxii
  2. Wei Cai, Vasily V. Bulatov, Tim G. Pierce, Masato Hiratani, Moono Rhee, Maria Bartelt et al.
    Pages 1-11
  3. Ronan Madec, Benoit Devincre, Ladislas Kubin
    Pages 35-44
  4. Erik Bitzek, Daniel Weygand, Peter Gumbsch
    Pages 45-57
  5. V. S. Deshpande, A. Needleman, E. Van der Giessen
    Pages 79-86
  6. Keiko Nakatani, Yoshihiko Sugiyama, Hiroshi Kitagawa
    Pages 107-116
  7. Satoshi Izumi, Shotaro Hara, Tomohisa Kumagai, Shinsuke Sakai
    Pages 117-127
  8. S. Brochard, J. Godet, L. Pizzagalli, P. Beauchamp
    Pages 129-138
  9. Pirouz Pirouz, Shanling Wang, Ming Zhang, Jean-Luc Demenet
    Pages 139-152
  10. Kenji Higashida, Masaki Tanaka
    Pages 153-162
  11. C. Pokor, Y. Bréchet, P. Dubuisson, J. P. Massoud, D. Rodney
    Pages 163-172
  12. D. J. Bacon, Yu. N. Osetsky, Z. Rong, K. Tapasa
    Pages 173-182
  13. M. A. Shehadeh, H. M. Zbib, T. Diaz de la Rubia, V. Bulatov
    Pages 183-192
  14. Krystyn J. Van Vliet, Ju Li, Ting Zhu, Yoonjoon Choi, Sidney Yip, Subra Suresh
    Pages 203-211
  15. Jinpeng Chang, Ting Zhu, Ju Li, Xi Lin, Xiao-Feng Qian, Sidney Yip
    Pages 223-233
  16. S. Groh, B. Devincre, F. Feyel, L. Kubin, A. Roos, J.-L. Chaboche
    Pages 235-244
  17. Sergey V. Dmitriev, Nobuhiro Yoshikawa, Aleksey A. Vasiliev
    Pages 279-288
  18. Kikuo Kishimoto, Masaki Omiya
    Pages 301-310
  19. Y. S. Kim, S. O. Choi, S. R. Lee, J. Kim
    Pages 331-341
  20. Ken-ichi Saitoh, Syuichi Nagase, Noboru Shinke, Hiroshi Kitagawa
    Pages 343-353
  21. Jakob Schiøtz, Søren L. Frederiksen
    Pages 355-363
  22. A. Nakatani, T. Shimokawa, R. Matsumoto, H. Kitagawa
    Pages 365-380
  23. Shigenobu Ogata, Ju Li, Yoji Shibutani, Sidney Yip
    Pages 401-410
  24. Back Matter
    Pages 441-448

About these proceedings


This volume contains the papers presented at the IUT AM Symposium of "Mesoscopic Dynamics of Fracture Process and Materials Strength", held in July 2003, at the Hotel Osaka Sun Palace, Osaka, Japan. The Symposium was proposed in 2001, aiming at organizing concentrated discussions on current understanding of fracture process and inhomogeneous deformation governing the materials strength with emphasis on the mesoscopic dynamics associated with evolutional mechanical behaviour under micro/macro mutual interaction. The decision of the General Assembly of International Union of Theoretical and Applied Mechanics (IUT AM) to accept our proposal was well-timed and attracted attention. Driven by the development of new theoretical and computational techniques, various novel challenges to investigate the mesoscopic dynamics have been actively done recently, including large-scaled 3D atomistic simulations, discrete dislocation dynamics and other micro/mesoscopic computational analyses. The Symposium attracted sixty-six participants from eight countries, and forty­ two papers were presented. The presentations comprised a wide variety of fundamental subjects of physics, mechanical models, computational strategies as well as engineering applications. Among the subjects, discussed are (a) dislocation patterning, (b) crystal plasticity, (c) characteristic fracture of amorphous/nanocrystal, (d) nano-indentation, (e) ductile-brittle transition, (f) ab-initio calculation, (g) computational methodology for multi-scale analysis and others.


Simulation Soliton Transformation calculus mechanics model modeling molecular dynamics plasticity stability

Editors and affiliations

  • H. Kitagawa
    • 1
  • Y. Shibutani
    • 1
  1. 1.Department of Mechanical Engineering and SystemsOsaka UniversityOsakaJapan

Bibliographic information

  • DOI
  • Copyright Information Springer Science+Business Media Dordrecht 2004
  • Publisher Name Springer, Dordrecht
  • eBook Packages Springer Book Archive
  • Print ISBN 978-90-481-6576-6
  • Online ISBN 978-1-4020-2111-4
  • Series Print ISSN 0925-0042
  • Buy this book on publisher's site