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Electrical Conductive Adhesives with Nanotechnologies

  • Yi Li
  • Daniel Lu
  • C. P. Wong

Table of contents

  1. Front Matter
    Pages i-xii
  2. Yi Li, Daniel Lu, C. P. Wong
    Pages 1-23
  3. Yi Li, Daniel Lu, C. P. Wong
    Pages 25-79
  4. Yi Li, Daniel Lu, C. P. Wong
    Pages 81-120
  5. Yi Li, Daniel Lu, C. P. Wong
    Pages 121-225
  6. Yi Li, Daniel Lu, C. P. Wong
    Pages 227-278
  7. Yi Li, Daniel Lu, C. P. Wong
    Pages 279-301
  8. Yi Li, Daniel Lu, C. P. Wong
    Pages 303-360
  9. Yi Li, Daniel Lu, C. P. Wong
    Pages 361-424
  10. Yi Li, Daniel Lu, C. P. Wong
    Pages 425-432
  11. Back Matter
    Pages 433-437

About this book

Introduction

Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently available. The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors also present examples of how conductive adhesives can be applied to nano techniques, while making important mentions of recent research and development breakthroughs in the fields.

Drawing upon tireless research, years of theoretical development and practical experience, and utilizing numerous visual examples and illustrative applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives in depth, while also describing:

  • The electrical properties, thermal performance, bonding pressure, assembly and reliability of numerous types of electrically conductive adhesives
  • The similarities and differences between lead-free soldering techniques and electrically conductive adhesives, while also discussing the advantages of ECAs.
  • Insights into the future of nano ECAs, as well as projections of future industry trends.

Electrical Conductive Adhesives with Nanotechnologies is a must-read for both researchers and active engineers in the electronic packaging field.

Keywords

electrical conductive adhesives electronic devices electronic packaging integrated circuit lead-free solder nano techniques nanotechnology

Authors and affiliations

  • Yi Li
    • 1
  • Daniel Lu
    • 2
  • C. P. Wong
    • 3
  1. 1.School of Materials Science &Georgia Institute of TechnologyAtlantaU.S.A.
  2. 2.Henkel Loctite (China) Co. Ltd.ChandlerChina, People's Republic
  3. 3.School of Materials Science &Georgia Institute of TechnologyAtlantaU.S.A.

Bibliographic information

  • DOI https://doi.org/10.1007/978-0-387-88783-8
  • Copyright Information Springer US 2010
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-0-387-88782-1
  • Online ISBN 978-0-387-88783-8
  • Buy this book on publisher's site