Materials for Advanced Packaging

  • Daniel Lu
  • C.P. Wong

Table of contents

  1. Front Matter
    Pages i-xii
  2. Rajen Chanchani
    Pages 1-50
  3. Chin C. Lee, Pin J. Wang, Jong S. Kim
    Pages 51-76
  4. Paul A. Kohl, Tyler Osborn, Ate He
    Pages 77-112
  5. Ning Cheng Lee
    Pages 181-218
  6. Werner Kroeninger
    Pages 219-242
  7. Gary Brist, Gary Long
    Pages 273-306
  8. Zhuqing Zhang, C. P. Wong
    Pages 307-337
  9. Daoqiang Daniel Lu, C.P. Wong
    Pages 365-405
  10. Shinji Takeda, Takashi Masuko
    Pages 407-436
  11. Ravi Prasher, Chia-Pin Chiu
    Pages 437-458
  12. Dok Won Lee, Liangliang Li, Shan X. Wang, Jiongxin Lu, C. P. Wong, Swapan K. Bhattacharya et al.
    Pages 459-502
  13. X.D. Wang, Z.L. Wang, H.J. Jiang, L. Zhu, C.P. Wong, J.E. Morris
    Pages 503-545
  14. Michael Töpper
    Pages 547-600
  15. Yuan-Chang Lin, Yan Zhou, Nguyen T. Tran, Frank G. Shi
    Pages 629-680
  16. Lei Mercado, James K. Carney, Michael J. Ebert, Scott A. Hareland, Rashid Bashir
    Pages 681-712

About this book

Introduction

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects.

This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including:

New bonding and joining techniques

Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates

Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives.

Materials and processing aspects on MEMS and wafer level chip scale packaging.

Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.

Keywords

Compound LED Nanomaterial development emerging technologies interconnect materials development microelectromechanical system (MEMS) microelectronic packaging nanomaterials nanopackaging optoelectronics packaging materials packaging techniques

Editors and affiliations

  • Daniel Lu
    • 1
  • C.P. Wong
    • 2
  1. 1.Henkel Locite Co., Ltd. Yantai, Shandong, P.R.China
  2. 2.Georgia Institute of TechnologyAtlantaUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-0-387-78219-5
  • Copyright Information Springer-Verlag US 2009
  • Publisher Name Springer, Boston, MA
  • eBook Packages Chemistry and Materials Science
  • Print ISBN 978-0-387-78218-8
  • Online ISBN 978-0-387-78219-5
  • About this book