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Design for Manufacturability and Statistical Design

A Constructive Approach

  • Michael Orshansky
  • Sani R. Nassif
  • Duane Boning

Table of contents

  1. Front Matter
    Pages I-XIV
  2. Sources of Variability

  3. Variability Characterization and Analysis

  4. Design Techniques for Systematic Manufacturability Problems

  5. Statistical Circuit Design

  6. Back Matter
    Pages 281-316

About this book

Introduction

Design for Manufacturability and Statistical Design: A Constructive Approach provides a thorough treatment of the causes of variability, methods for statistical data characterization, and techniques for modeling, analysis, and optimization of integrated circuits to improve yield. The objective of the constructive approach developed in this book is to formulate a consistent set of methods and principles necessary for rigorous statistical design and design for manufacturability from device physics to large-scale circuit optimization. The segments of the book are devoted, respectively, to

  • understanding the causes of variability;
  • design of test structures for variability characterization;
  • statistically rigorous data analysis;
  • techniques of design for manufacturability in lithography and in chemical mechanical polishing;
  • statistical simulation, analysis, and optimization techniques for improving parametric yield.

Design for Manufacturability and Statistical Design: A Constructive Approach presents an overview of the methods that need to be mastered for state-of-the-art design for manufacturability and statistical design methodologies.  It is an important reference for practitioners and students in the field of computer-aided design of integrated circuits.

Keywords

Computer-Aided Design (CAD) Simulation circuit design data analysis integrated circuit modeling optimization

Authors and affiliations

  • Michael Orshansky
    • 1
  • Sani R. Nassif
    • 2
  • Duane Boning
    • 3
  1. 1.The University of Texas at AustinAustinUSA
  2. 2.IBM Research LaboratoriesAustinUSA
  3. 3.Massachusetts Institute of TechnologyCambridgeUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-0-387-69011-7
  • Copyright Information Springer Science+Business Media, LLC 2008
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-0-387-30928-6
  • Online ISBN 978-0-387-69011-7
  • Buy this book on publisher's site