Solder Joint Technology

Materials, Properties, and Reliability

  • King-Ning Tu

Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 117)

Table of contents

  1. Front Matter
    Pages I-XVI
  2. Introduction

    1. King-Ning Tu
      Pages 1-33
  3. Copper—Tin Reactions

  4. Electromigration and Thermomigration

  5. Back Matter
    Pages 347-370

About this book

Introduction

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Keywords

development manufacturing material materials metal reliability thin film

Authors and affiliations

  • King-Ning Tu
    • 1
  1. 1.Department of Materials Science and EngineeringUniversity of California at Los AngelesLos AngelesUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-0-387-38892-2
  • Copyright Information Springer 2007
  • Publisher Name Springer, New York, NY
  • eBook Packages Chemistry and Materials Science
  • Print ISBN 978-0-387-38890-8
  • Online ISBN 978-0-387-38892-2
  • Series Print ISSN 0933-033X
  • Series Online ISSN 2196-2812
  • About this book