Nanomechanics of Materials and Structures

  • T. -J. Chuang
  • P. M. Anderson
  • M. -K. Wu
  • S. Hsieh

Table of contents

  1. Front Matter
    Pages i-xvii
  2. Ken P. Chong
    Pages 13-22
  3. J. Slutsker, A. L. Roytburd, G. B. McFadden, J. A. Warren
    Pages 33-43
  4. S. Guruzu, G. Xu, H. Liang
    Pages 45-54
  5. Chunyu Li, Tsu-Wei Chou
    Pages 55-65
  6. Tze-jer Chuang
    Pages 67-78
  7. H. Jiang, Y. Huang, P. Zhang, K. C. Hwang
    Pages 79-88
  8. V. K. Tewary, D. T. Read
    Pages 89-98
  9. Joanna Aizenberg
    Pages 99-108
  10. Fan-Gang Tseng
    Pages 109-119
  11. E. P. S. Tan, C. T. Lim
    Pages 121-137
  12. Weileun Fang, Jerwei Hsieh, Hung-Yi Lin
    Pages 151-159
  13. A. F. Bower, J. H. Weiner
    Pages 161-170
  14. H. Y. Hou, N. K. Chang, S. H. Chang
    Pages 171-180
  15. Fei-Bin Hsiao, Yung-Chun Lee, Chuan-Pu Liu, Cheng-Hsin Chuang, Chun-Ping Jen, Di-Bao Wang et al.
    Pages 181-189
  16. N. Kalyanasundaram, M. C. Moore, J. B. Freund, H. T. Johnson
    Pages 191-198
  17. R. Ruoff, N. Pugno
    Pages 199-203
  18. Ting Zhu, Ju Li, Sidney Yip
    Pages 217-223
  19. Peter Schall, Itai Cohen, David A. Weitz, Frans Spaepen
    Pages 255-261
  20. W. M. Mook, M. D. Chambers, C. R. Perrey, C. B. Carter, R. E. Miller, W. A. Curtin et al.
    Pages 263-275
  21. Yan-Fei Gao, Allan F. Bower
    Pages 277-287
  22. Feodor M. Borodich, Chad S. Korach, Leon M. Keer
    Pages 299-308
  23. Back Matter
    Pages 309-323

About these proceedings


This book is derived from the proceedings of the International Workshop on Nanomechanics held at Asilomar Conference Grounds in Pacific Grove, California on July 14-17, 2004. Approximately 70 leading experts from academia, government and industrial sectors in semiconductors, computers, communication, information technology, defense, energy, transportation and aerospace attended the Workshop (see the workshop photo taken on July 16, 2004). The main objective was to convene leading researchers in the nanotechnology community to assess the current state-of-the-art and disseminate recent progress, critical issues, barriers to applications, and directions for future research in nanomechanics. Miniaturization of structural components and functional devices such as electronic, optical, mechanical and electric-magnetic parts has been a recent trend, and the pace has accelerated over the past few years. Advances in micromanufacturing, semiconductor processing (e.g., etching, lithography, grafting, etc.), sensors, actuators and microprocessors have opened up a revolutionary path to the development of new technologies such as micro-electro-mechanical systems (MEMS), nano-electro-mechanical systems (NEMS), micro-engines, smart structures, smart controllers, lab-- a-chip devices, and even bio-medical sensing devices which can detect, analyze, decide and activate appropriate functions in real time. The above-mentioned devices, structures, or systems, have one issue in common. In order to perform their assigned functions, they must maintain their structural integrity and be reliable and durable during their entire designed service life. Thus, strength, durability, and time-dependent mechanical property degradation are major concerns for design engineers and device manufacturers, even though the parts are designed for electronic, magnetic, optical or other functions.


Motor Nanotube Sensor biotechnology carbon nanotubes development laser materials science microelectromechanical system (MEMS) microsystems naadje nanotechnology production simulation

Editors and affiliations

  • T. -J. Chuang
    • 1
  • P. M. Anderson
    • 2
  • M. -K. Wu
    • 3
  • S. Hsieh
    • 4
  1. 1.National Institute of Standards and TechnologyGaithersburgUSA
  2. 2.Ohio State UniversityColumbusUSA
  3. 3.National Science CouncilTaipeiTaiwan, ROC
  4. 4.Asylum Research CorporationSanta BarbaraUSA

Bibliographic information

  • DOI
  • Copyright Information Springer 2006
  • Publisher Name Springer, Dordrecht
  • eBook Packages Engineering
  • Print ISBN 978-1-4020-3950-8
  • Online ISBN 978-1-4020-3951-5
  • Buy this book on publisher's site