Microscale Heat Transfer Fundamentals and Applications

Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer — Fundamentals and Applications in Biological and Microelectromechanical Systems Cesme-Izmir, Turkey 18–30 July 2004

  • S. Kakaç
  • L.L. Vasiliev
  • Y. Bayazitoğlu
  • Y. Yener

Part of the NATO Science Series II: Mathematics, Physics and Chemistry book series (NAII, volume 193)

Table of contents

  1. Front Matter
    Pages i-viii
  2. Y. Yener, S. Kakaç, M. Avelino, T. Okutucu
    Pages 1-24
  3. M. D. Mikhailov, R. M. Cotta, S. Kakaç
    Pages 49-74
  4. Y. Bayazitoglu, S. Kakaç
    Pages 75-92
  5. Y. Bayazitoglu, G. Tunc, K. Wilson, I. Tjahjono
    Pages 125-148
  6. R.M. Cotta, S. Kakaç, M.D. Mikhailov, F.V. Castellões, C.R. Cardoso
    Pages 175-196
  7. V. K. Dhir, H. S. Abarajith, G. R. Warrier
    Pages 197-216
  8. André Bontemps, Bruno Agostini, Nadia Caney
    Pages 217-230
  9. M. Fabbri, S. Jiang, G. R. Warrier, V. K. Dhir
    Pages 231-254
  10. V.V. Kuznetsov, O.V. Vitovsky, A.S. Shamirzaev
    Pages 255-272
  11. V.V. Kuznetsov, S.A. Safonov
    Pages 303-320

About these proceedings

Introduction

This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

Keywords

Absorption Finite-Elemente-Methode crystal heat transfer simulation

Editors and affiliations

  • S. Kakaç
    • 1
  • L.L. Vasiliev
    • 2
  • Y. Bayazitoğlu
    • 3
  • Y. Yener
    • 4
  1. 1.University of MiamiCoral GablesUSA
  2. 2.Luikov Heat and Mass Transfer InstituteMinskBelarus
  3. 3.Rice UniversityHoustonUSA
  4. 4.Northeastern UniversityBostonUSA

Bibliographic information

  • DOI https://doi.org/10.1007/1-4020-3361-3
  • Copyright Information Springer 2005
  • Publisher Name Springer, Dordrecht
  • eBook Packages Engineering
  • Print ISBN 978-1-4020-3359-9
  • Online ISBN 978-1-4020-3361-2
  • Series Print ISSN 1568-2609
  • About this book