Abstract
We report experimental results on the microfabrication of three types of folded waveguide circuits with a high aspect ratio by using a high-energy X-ray LIGA technique. A W-band folded waveguide with a total of 80 periods was designed for a traveling-wave-tube (TWT) amplifier operating at 90 GHz–100 GHz. The measured return loss and insertion loss of the W-band fabricated circuit were–10 dB and 0.42 dB/cm, respectively. A G-band circuit showed a higher insertion loss of 1.57 dB/cm. An additional circuit fabrication for a 850-GHz folded waveguide TWT was also successfully carried out. The broad-wall angle measured with respect to the narrow wall of the rectangular waveguide was very close to 90◦, indicating an excellent resolution compared to that of other microfabrication techniques, such as deep reactive ion etching (DRIE) and ultraviolet (UV) lithography, electroplating, and polymer replication (LIGA).
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References
A. G. Davies, E. H. Linfield and M. B. Johnston, Phys. Med. Biol. 47, 3679 (2002).
J. H. Booske et al., IEEE Trans. Terahertz Sci. Tech. 1, 54 (2011).
C. W. Baik et al., Appl. Phys. Lett. 101, 073508 (2012).
K. E. Kreischer, J. C. Tucek, D. A. Gallagher and R. E. Mihailovich, in 33rd International Conf on Infrared Millimeter and Terahertz Waves (Pasadena, 2008).
C. D. Joye, J. P. Calame, K. T. Nguyen and M. Garven, J. Micromech. Microeng. 22, 015010 (2012).
Y. M. Shin et al., Appl. Phys. Lett. 88, 091916 (2006).
Y. H. Na, S. W. Chung and J. J. Choi, IEEE Trans. Plasma Sci. 30, 1017 (2002).
High Frequency Structure Simulator, Version 13, ANSYS Co.
Y. M. Shin, G. S. Park, G. P. Scheitrum and B. Arfin, IEEE Trans. Plasma Sci. 31, 1317 (2003).
Y. Li, P. L. Kirby and J. Papapolymerou, in 2006 IEEE MTT-S International Microwave Symposium Digest (San Francisco, USA, June 11–16, 2006).
H. Y. Li, J. J. Feng and G. D. Bai, in 2011 IEEE International Vacuum Electronics Conference (Bangalore, India, February 21–24, 2011).
A. M. Cook et al., in 2013 IEEE 14th International Vacuum Electronics Conference (Paris, France, May 21–23, 2013).
Y. M. Shin et al., Appl. Phys. Lett. 88, 091916 (2006).
Y. M. Shin, G. S. Park, G. P. Scheitrum and B. Arfin, IEEE Trans. Plasma Sci. 31, 1317 (2003).
E. Hammerstad and O. Jensen, in 1980 IEEE MTT-S Int. Microwave Symposium Digest (Washington, USA, 1980).
M. P. Kirley and John H. Booske, IEEE Trans. Terahertz Sci. Tech. 5, 1012 (2015).
Acknowledgments
This work was conducted during sabbatical leave in 2018 and was supported by Kwangwoon University. The authors would like to acknowledge financial support from United States Office of Naval Research Global office (Grant number: N62909-15-1-2059) and the Agency for Defense Development, Republic of Korea.
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Jang, K.H., Choi, J.J. & Kim, J.H. X-ray LIGA Microfabricated Circuits for a Sub-THz Wave Folded Waveguide Traveling-Wave-Tube Amplifier. J. Korean Phys. Soc. 75, 716–723 (2019). https://doi.org/10.3938/jkps.75.716
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DOI: https://doi.org/10.3938/jkps.75.716