Abstract
The work function (WF) of Pt-Ru bimetallic alloy (BA) films prepared by atomic layer deposition (ALD) was systemically investigated depending on the thickness. Pt-Ru BA films were deposited using a supercycle consisted of 10 subcycles for Pt and 1 subcycle for Ru. And, the thicknesses of Pt-Ru BA films were carefully controlled from 2.9 to 35.7 nm through changing the number of supercycles. Although a fixed ALD supercycle was used, the composition of Pt-Ru BA films was gradually changed and then saturated to Pt: ∼92 at.% and Ru: ∼8 at.% with increasing the film thickness. In addition, the microstructural evolution of Pt-Ru BA films happened from island-like nuclei to continuous film at an initial growth stage. As a result, the WF and electrical resistivity of ALD Pt-Ru BA films exhibited saturated values of ∼5.36 eV and ∼19.95 µΩ·cm, respectively at higher than 8.7 nm thickness.
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Acknowledgments
This work was supported by the Future Semiconductor Device Technology Development Program (10067739) funded by Ministry of Trade, Industry & Energy (MOTIE) and Korea Semiconductor Research Consortium (KSRC).
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Kim, CM., Lee, WJ., Bera, S. et al. Effect of the Film Thickness on the Work Function of Pt-Ru Bimetallic Alloy Films by Atomic Layer Deposition. J. Korean Phys. Soc. 75, 1–4 (2019). https://doi.org/10.3938/jkps.75.1
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DOI: https://doi.org/10.3938/jkps.75.1