Modeling and analyzing for contact hole shrinkage by directed self-assembly
- 38 Downloads
For fine pattern formation, the pattern shrinkage process is indispensable in the lithography process in terms of cost and simplicity. In this paper, a full-shrinkage process of contact holes (C/H) with the directed self-assembly (DSA) of a block copolymer (BCP) is modeled and simulated by using the dissipative particle dynamics (DPD). Simulation results show good agreement with experiment results. This simulation can explain how DSA C/H shrinkage behaves differently for different-sized and -shaped features. The sensitivities of the simulation parameters for the simulated profiles are analyzed by using a Taguchi analysis. Through the sensitivities of these easy-to-optimize parameters, DSA C/H shrinkage can be effectively predicted.
KeywordsLithography Lithography simulation Shrinkage process Directed self-assembly DSA Block copolymer BCP
Unable to display preview. Download preview PDF.
- T. Younkin et al., SPIE 8682, 86820L (2013).Google Scholar
- N. Laachi, K. T. Delaney, B. Kim, S.-M. Hur, R. Bristol, D. Shykind, C. J. Weinheimer and G. H. Fredrickson, SPIE 8680, 868014 (2013).Google Scholar
- Y. Seino et al., SPIE 8323, 83230Y (2012).Google Scholar
- C. Bencher et al., SPIE 8323, 83230N (2012).Google Scholar