Journal of the Korean Physical Society

, Volume 65, Issue 10, pp 1701–1705 | Cite as

Modeling and analyzing for contact hole shrinkage by directed self-assembly

  • Sang-Kon KimEmail author


For fine pattern formation, the pattern shrinkage process is indispensable in the lithography process in terms of cost and simplicity. In this paper, a full-shrinkage process of contact holes (C/H) with the directed self-assembly (DSA) of a block copolymer (BCP) is modeled and simulated by using the dissipative particle dynamics (DPD). Simulation results show good agreement with experiment results. This simulation can explain how DSA C/H shrinkage behaves differently for different-sized and -shaped features. The sensitivities of the simulation parameters for the simulated profiles are analyzed by using a Taguchi analysis. Through the sensitivities of these easy-to-optimize parameters, DSA C/H shrinkage can be effectively predicted.


Lithography Lithography simulation Shrinkage process Directed self-assembly DSA Block copolymer BCP 


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Copyright information

© The Korean Physical Society 2014

Authors and Affiliations

  1. 1.Department of Applied PhysicsHanyang UniversityAnsanKorea

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