Abstract
The FPGA (field programmable gate array) manufactured by using the CCGA484 (ceramic column grid array 484) package has been increasingly growing in demand day by day. However, the CCGA484 package has not been evaluated in space programs yet. In addition, the CCGA484 package is soldered on a PCB (printed circuit board) by the combination of Pb and Sn in ratios from 37% to 67%. If the thermal characteristics of the device for use in space program is to be improved and the numbers of input ports, output ports and internal gates are to increased, the pin quantity and other characteristics of the CCGA484 package must be ensured. During the qualification test for the application of the CCGA484 package in space programs, the changes in properties of the materials in the soldered parts and the changes in the electrical and the physical characteristic were investigated and yielded results that the dose increased from 0 krad to 100 krad. The difference between the electric potential before the radiation and after the accumulation of radiation was less than 0.01%.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Actel data sheet, Ceramic Column Grid Array: Actel Application Note AC190 (Actel, CA, USA, 2008).
R. Kuang and L. Zhao, Thermal Cycling Test Report for Ceramic Column Grid Array Packages (Actel test report, CA, USA, 2011).
Actel qualification report, Solder Column Qualification for Ceramic Column Grid Array (CCGA) White Paper (Colorado, USA, 2008).
Actel, EIA Standard Board Layout Drawing for BGA, CCGA, CSP and QFN (Actel, CA, USA, 2009).
R. I. Masel, Circuit Theory (Wiley, New York, 1996).
Microsemi test report, Thermal Cycling Test Report for Ceramic Column Grid Array Packages (Microsemi, CA, USA, 2011).
G. H. Shin, K. S. Ryu, N. H. Myung and E. E Kim, J. Korean Phys. Soc. 59, 670 (2011).
H. Schmidt, K. Grüumann, B. Nickson, F. Gliem and R. H. Sørensen, IEEE Trans. Nucl. Sci. 56, 1937 (2009)
G. H. Shin, K. S. Ryu, H. M. Kim and K. W. Min, J. Korean Phys. Soc. 52, 843 (2008).
G. Cellere, A. Paccagnella, A. Visconti, M. Bonanomi, P. Caprara and S. Lora, IEEE Trans. Nucl. Sci. 51, 3753 (2004).
S. Bertazzoni et al., in Proceedings of the 2005 RADECS (Cap d’Agde, France, September 19–23, 2005), p. PW11–1.
M. J. Baek, D. Y. Kim and H. J. Kim, J. Astron. Space Sci. 18, 163 (2001).
J. Schwank, in 2002 IEEE NSREC Short Course (IEEE Publishing Services, Piscataway, New Jersey, 2002).
J. R. Brews, Applied Solid State Science, edited by Dawon Kahny (Academic Press, New York, 1981).
Y. Taur and T. H. Ning, Fundamentals of Modern VLSI Devices (Cambrige University Press, New York, 1998).
S. M. Seltzer, Updated Calculations for Routine Space-Shielding Eadiation Dose Estimates: SHIELDOSE-2(NIST Publication NISTIR 5477, Gaithersburg, MD, 1994).
ISO/ASTM 51607, Practice for Use of the Alanine-EPR Dosimetry System.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Shin, GH., Seo, JK., Park, HY. et al. Measurement of change in properties of PCB for the irradiation of Co-60 gamma-ray for space application of CCGA484 daisy chain FPGA device. Journal of the Korean Physical Society 63, 1451–1454 (2013). https://doi.org/10.3938/jkps.63.1451
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.3938/jkps.63.1451