Abstract
High-conductivity contacts in place of screen-printed contacts are in demand for commercial solar cells. Also, simplifying the process steps is required for commercial solar cells. In addition, very expensive metals are necessary improved efficiency without using scarce. In this research, we replaced screen-printed contacts with Ni/Cu contacts in passivated emitter solar cells. A layer of nickel was used as the seed and the adhesion layer. The main contact was formed by plating with copper. Firing conditions in a conventional furnace were varied so as to form nickel silicide. The best cell showed a solar cell efficiency of 18.76%.
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Min, S.K., Lee, S.H. A study of nickel silicide in a conventional furnace for Ni/Cu contact monocrystalline-silicon solar cells. Journal of the Korean Physical Society 62, 234–237 (2013). https://doi.org/10.3938/jkps.62.234
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DOI: https://doi.org/10.3938/jkps.62.234