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Journal of the Korean Physical Society

, Volume 74, Issue 2, pp 82–87 | Cite as

Functionalized Bonding Materials and Interfaces for Heterogeneously Layer-Stacked Applications

  • Sanghyeon KimEmail author
  • Jae-Hoon Han
  • Won Jun Choi
  • Jin Dong Song
  • Hyung-jun Kim
Review Articles
  • 31 Downloads

Abstract

Recently, heterogeneous integration has become more important in enhancing device performance and creating new functions. For this purpose, wafer bonding can provide a straightforward method to integrate different materials, regardless of lattice mismatch. Here, we review recent application spaces using low-temperature wafer bonding by classifying wafer bonding into direct bonding, oxide bonding, and metal bonding. We show that bonding materials and interfaces have an important role in achieving high-performance semiconductor devices.

Keywords

Wafer bonding Heterogeneous integration Bonding interface Monolithic 3D integration 

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Copyright information

© The Korean Physical Society 2019

Authors and Affiliations

  • Sanghyeon Kim
    • 1
    Email author
  • Jae-Hoon Han
    • 2
  • Won Jun Choi
    • 2
  • Jin Dong Song
    • 2
  • Hyung-jun Kim
    • 3
  1. 1.School of Electrical Engineering, KAISTDaejeonKorea
  2. 2.Center for Opto-electronic Materials and DevicesKorea Institute of Science and Technology (KIST)SeoulKorea
  3. 3.Center for SpintronicsKorea Institute of Science and Technology (KIST)SeoulKorea

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