Journal of the Korean Physical Society

, Volume 64, Issue 10, pp 1430–1436 | Cite as

Electroluminescence of n-Ge/i-Ge/p-Si heterojunction PIN LEDs

  • Yeon-Ho Kil
  • Jong-Han Yang
  • Joung Hee Kim
  • Joo Yong Jeong
  • Sukill Kang
  • Tae Soo Jeong
  • Chel-Jong Choi
  • Taek Sung Kim
  • Kyu-Hwan Shim
Article

Abstract

A PIN Light Emitting Diode (LED) was fabricated from the n-Ge/i-Ge/p-Si heterojunction structure grown by using Rapid Thermal Chemical Vapor Deposition (RTCVD). Ge buffer layers were grown at 350 °C with a thickness of ~110 nm in the first step. Then, high-temperature i-Ge layers were grown at 500 °C with a thickness of ~1.40 μm in the second step. The phosphorusdoped n-type Ge layers were grown at 500 °C with a thickness of ~0.61 µm in the third step. The surface morphology of the n-Ge/i-Ge layer was mirror like and the n-Ge/i-Ge layer was under a tensile strain of ~0.071%. Current-voltage characteristics of the PIN LED indicated a reasonable reverse saturation current of 140 μA at −1V. Electroluminescence characteristics showed a shift of the direct band gap to lower energies based on the depending of maximum peak position on the injection current. The direct band gap of the tensile-strained LEDs was found to be 0.746 eV.

Keywords

Electroluminescence Heterostructure RTCVD Ge PIN LED 

PACS numbers

78.40.Fy 

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Copyright information

© The Korean Physical Society 2014

Authors and Affiliations

  • Yeon-Ho Kil
    • 1
  • Jong-Han Yang
    • 1
  • Joung Hee Kim
    • 1
  • Joo Yong Jeong
    • 1
  • Sukill Kang
    • 1
  • Tae Soo Jeong
    • 1
  • Chel-Jong Choi
    • 1
  • Taek Sung Kim
    • 1
  • Kyu-Hwan Shim
    • 1
  1. 1.Semiconductor Physics Research Center, School of Semiconductor and Chemical Engineering, and Department of PhysicsChonbuk National UniversityJeonjuKorea

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