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Precision machining of hard brittle crystalline materials to obtain nanometric surface relief

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References

  1. Teplova, T.B. and Samerkhanova, A.S., Trends in the Use of Hard High-Strength Minerals in Microelectronics, Medicine, and Jewelry, GIAB, 2006, no. 10, pp. 338–346.

  2. Teplova, T.B., Prospects for Dimensionally Regulated Grinding of Hard High-Strength Materials, GIAB, 2005, no. 1, pp. 90–94.

  3. Teplova, T.B. Principles for the Production of Nanometric Surface Relief in Machining Hard Brittle Materials Used in Electronics, Stanki Instrum., 2009, no. 5, pp. 34–40.

  4. Teplova, T.B., Quasi-Plastic Machining of Hard Brittle Crystalline Materials Used in Electronics, to Improve Surface Quality, NanoMicrosist. Tekhn., 2008, no. 2, pp. 45–47.

  5. Teplova, T.B., Theoretical Interpretation of Dimensionally Regulated Grinding of Hard Materials, GIAB, 2007, no. 2, pp. 363–370.

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Authors and Affiliations

  1. Moscow State Technical University, Moscow, Russia

    V. V. Solov’ev

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  1. V. V. Solov’ev
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Original Russian Text © V.V. Solov’ev, 2011, published in STIN, 2011, No. 2, pp. 37–40.

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Solov’ev, V.V. Precision machining of hard brittle crystalline materials to obtain nanometric surface relief. Russ. Engin. Res. 31, 515–517 (2011). https://doi.org/10.3103/S1068798X11050212

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  • DOI: https://doi.org/10.3103/S1068798X11050212

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