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Design and Achievement of Superfilling Electroless Silver Deposition for Micrometer Trenches

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Abstract

Electroless silver bottom-up filling has been designed and investigated by linear sweep voltammetry. It was found that the addition of polyethylene glycol 4000 (PEG 4000) had a good inhibitory effect on the electrode reaction. Experiments showed that PEG 4000 had a strong depressing action in electroless silver deposition. Specifically, when the PEG 4000 concentration was 1.0 mg/L, the plating rate of electroless silver decreased from 5.7 to 2.3 μm/h. The bottom-up silver fillings for different-sized trenches were achieved in an electroless plating bath with the addition of PEG 4000. The trenches analysis showed that all microtrenches with different widths were completely filled by electroless silver plating.

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Funding

The authors express their gratitude to the Provincial Natural Science Foundation of Zhejiang China (Y14E010005) and the Foundation of Research Program of Public Welfare Technology Application (2019GYX02) for supporting this research.

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Authors and Affiliations

  1. College of Ecology, Lishui University, 323000, Lishui, China

    Xu Wang & Weiwu Ma

  2. School of Pharmacy and Life Sciences, Robert Gordon University, AB107GJ, Aberdeen, UK

    Carlos Fernandez

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  1. Xu Wang
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  2. Weiwu Ma
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  3. Carlos Fernandez
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Correspondence to Xu Wang.

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Xu Wang, Ma, W. & Fernandez, C. Design and Achievement of Superfilling Electroless Silver Deposition for Micrometer Trenches. Surf. Engin. Appl.Electrochem. 59, 15–19 (2023). https://doi.org/10.3103/S1068375523010143

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