Abstract—
The process of chemical etching of Cu98Be alloy in solutions of various compositions was studied. The dilution rate of beryllium bronze in the solutions examined was determined, and its change with time was analyzed. The selectivity of Cu98Be components’ dissolution during the long-term etching in solutions with different electrolytes was established. A possibility of obtaining a Cu98Be uniform etching by varying the composition of the etching solution was shown. The concentrations of metal ions in the etching solutions used were determined, and the capacitance of those solutions was calculated. The compositions of solutions with a high capacity for both of the alloy components during long-term etching were determined. The optimal compositions of etching solutions ensuring the high-quality etching of beryllium bronze according to several criteria, such as a high process rate, uniform dissolution of the alloy components, and high capacity for both alloy components, were proposed. The morphology of the Cu98Be electrode surface after etching in solutions ensuring uniform dissolution for both alloy components was studied. The absence of surface passivation after chemical etching in those solutions was shown. The chemical nature of the compounds formed in the shape of small inclusions on the etched surface of the electrode was established. The obtained results are of great importance for the practical use because they allow selecting the appropriate composition of the etching solution, which, in turn, facilitates optimization of the technological etching process.
REFERENCES
Nester, A.A., Ochistka stochnykh vod proizvodstva pechatnykh plat (Wastewater Treatment of Printed Circuit Board Production), Khmelnytskyi: Izd. Khmelnytsk. Nats. Univ., 2016.
Tebyakin, A., Fokanov, A., and Podurazhnaya, V., Multifunctional copper alloys, Tr. Vseross. Inst. Aviats. Mater., 2016, no. 12 (48), p. 37.
Kachagin, A., Krivokhizhina, N., Savitskii, A., and Korotkova, N., Creation of a complex for the manufacture of spring parts, Proizvod. Elektron.: Tekhnol., Oborud., Mater., 2008, no. 5, p. 41.
Medvedev, A., Materials for flexible printed circuit boards, Tekhnol. Elektron. Prom-st., 2011, no. 3, p. 12.
Altenberger, I., Kuhn, H.A., and Muller, H.R., Material properties of high-strength beryllium-free copper alloys, Int. J. Mater. Prod. Technol., 2015, vol. 50, no. 2, p. 124.
Medvedev, A., Designs and principles of manufacturing printed circuit boards, Tekhnol. Elektron. Prom-st., 2011, no. 4, p. 26.
Smertina, T., Surface preparation of copper. Mechanical or chemical? Tekhnol. Elektron. Prom-st., 2005, no. 3, p. 12.
Smertina, T., High precision etching. From theory to practice, Tekhnol. Elektron. Prom-st., 2008, no. 3, p. 12.
Moshchenok, V.I., Determining the hardness of materials by pressing a spherical indenter, Ukraine. Certificate of copyright registration for the work 48174, March 4, 2013.
Osintsev, O.E. and Fedorov, V.N., Med’ i mednye splavy. Otechestvennye i zarubezhnye marki. Spravochnik (Copper and Copper Alloys. Domestic and Foreign Brands. Reference Book), Moscow: Mashinostroenie, 2004.
Sposoby metallograficheskogo travleniya. Spravochnoe izdanie (Methods of Metallographic Etching. Reference Edition), Moscow: Metallurgiya, 1988.
Egorova, L.M., Khobotova, E.B., Larin, V.I., and Yurchenko, O.I., Study of the process of etching α‑brass in concentrated chloride solutions, Vopr. Khim. Khim. Tekhnol., 2009, no. 6, p. 155.
Larin, V.I. and Egorova, L., Chemical ionization of beryllium bronze alloy in chloride solutions, Ukr. Khim. Zh., 2018, vol. 84, no. 3, p. 20.
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Translated by M. Baznat
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Egorova, L.M., Larin, V.I. & Datsenko, V.V. Chemical Etching of Cu98Be Alloy in Electrolyte Solutions. Surf. Engin. Appl.Electrochem. 59, 7–14 (2023). https://doi.org/10.3103/S1068375523010052
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DOI: https://doi.org/10.3103/S1068375523010052