Abstract
The results of experimental studies of the influence of the plasmodynamic deposition conditions of a copper coating on an aluminum contact surface on the contact resistance of an aluminum-copper high-current contact pair with a copper coating are presented. A significant decrease in contact resistance relative to an ordinary contact between aluminum and copper is observed as a result of optimization of the phase composition and structure of the transition layer.
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References
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Additional information
Original Russian Text © A.A. Sivkov, A.S. Saigash, Yu.L. Kolganova, 2013, published in Elektrotekhnika, 2013, No. 8, pp. 11–14.
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Sivkov, A.A., Saigash, A.S. & Kolganova, Y.L. The influence of the properties of a copper coating deposited on an aluminum contact surface on contact resistance. Russ. Electr. Engin. 84, 418–421 (2013). https://doi.org/10.3103/S1068371213080129
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DOI: https://doi.org/10.3103/S1068371213080129