Abstract
Regularities and mechanisms of the creep of submicrocrystalline copper and Cu-1.1 vol % Al2O3 dispersion-hardened powder composite in a temperature range of (0.2–0.35) T m Cu have been investigated. The role that the grain-boundary state and dispersion-hardening material with Al2O3 nanosized (10–40 nm) particles plays in the development of plastic deformation during creep is analyzed.
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Original Russian Text © G.P. Grabovetskaya, I.P. Mishin, Yu.R. Kolobov, 2009, published in Izvestiya VUZ. Poroshkovaya Metallurgiya i Funktsional’nye Pokrytiya, 2009, No. 2, pp. 38–43.
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Grabovetskaya, G.P., Mishin, I.P. & Kolobov, Y.R. The effect of dispersion hardening on the regularities and mechanisms of the creep of copper with submicron grain sizes. Russ. J. Non-ferrous Metals 50, 540–544 (2009). https://doi.org/10.3103/S1067821209050204
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DOI: https://doi.org/10.3103/S1067821209050204