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Contribution from dislocation to deformation resistance in polycrystals of copper-based solid solutions

  • Proceedings of the 7th International Conference “Phase Transitions and the Strength of Crystals”
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Bulletin of the Russian Academy of Sciences: Physics Aims and scope


The evolution of dislocation structure in solid solutions of Cu-Al and Cu-Mn systems with different grain sizes and at different test temperatures is studied by means of transmission electron diffraction microscopy. The scalar density of dislocations is measured and its relationship to the flow stress of alloys is determined. Changes in the contribution from dislocation hardening to deformation resistance upon variations in the contributions associated with changes in grain size, solid-solution hardening, and test temperature are analyzed.

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Correspondence to N. A. Koneva.

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Original Russian Text © N.A. Koneva, L.I. Trishkina, E.V. Kozlov, 2013, published in Izvestiya Rossiiskoi Akademii Nauk. Seriya Fizicheskaya, 2013, Vol. 77, No. 11, pp. 1697–1700.

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Koneva, N.A., Trishkina, L.I. & Kozlov, E.V. Contribution from dislocation to deformation resistance in polycrystals of copper-based solid solutions. Bull. Russ. Acad. Sci. Phys. 77, 1397–1400 (2013).

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