Abstract
The paper considers basic features of thermal processes in structural modules of radioelectronic device (cell, microassembly) and elements of their electronic structure. The efficiency factors of modules and the indicators of energy performance of resistors, capacitors, and inductors were analyzed on the basis of models of equivalent two-pole networks. The mathematical model of microassembly thermal field was proposed and the analytical equation for determining temperatures of all its elements was derived.
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B. M. Uvarov and Yu. F. Zinkovskyi, Optimization of Thermal Conditions and Reliability of Structural Designs of Electronic Hardware with Probabilistic Characteristics (Korniichuk, Kyiv, 2011) [in Ukrainian].
A. V. Lykov, Heat Mass Exchange (Reference Book), 2nd ed. (Energiya, Moscow, 1978) [in Russian].
Standard of Ukraine DSTU 2992-96. Electronic Devices. Reliability Calculation Methods (1996) [in Ukrainian].
S. F. Prytkov, V. M. Gorbacheva, M. N. Martynova, G. A. Petrov, Reliability of Electronic Components / Reference Book (MO RF & NII Elektronstandart, 2004) [in Russian].
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Original Russian Text © B.M. Uvarov, Yu.F. Zin’kovskii, 2015, published in Izv. Vyssh. Uchebn. Zaved., Radioelektron., 2015, Vol. 58, No. 11, pp. 39–48.
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Uvarov, B.M., Zin’kovskii, Y.F. Electrothermal models of structural elements of radioelectronic device. Radioelectron.Commun.Syst. 58, 506–514 (2015). https://doi.org/10.3103/S0735272715110047
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DOI: https://doi.org/10.3103/S0735272715110047