Abstract
Thin films of copper selenide (CuSe) were physically deposited layer-by-layer up to 5 layers using thermal evaporation technique onto a glass substrate. Various film properties, including the thickness, structure, morphology, surface roughness, average grain size and electrical conductivity are studied and discussed. These properties are characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), ellipsometer and 4 point probe at room temperature. The dependence of electrical conductivity, surface roughness, and average grain size on number of layers deposited is discussed.
Similar content being viewed by others
References
S. Y. Zhang et al., Cryst. Growth Des. 6, 2809 (2006)
S. T. Lakshmikumar, A. C. Rastogi, Sol. Energ. Mat. Sol. C. 32, 7 (1994)
W. S. Chen, J. M. Stewart, R. A. Mickelsen, Appl. Phys. Lett. 46, 1095 (1985)
C. Levy-Clement, M. Neumann-Spallart, S. K. Haram, K. S. V. Santhanam, Thin Solid Films 302, 12 (1997)
V. M. Bhuse, P. P. Hankare, K. M. Garadkar, A. S. Khomane, Mater. Chem. Phys. 80, 82 (2003)
S. R. Gosavi, N. G. Deshpande, Y. G. Gudage, R. Sharma, J. Alloy Compd. 448, 344 (2008)
D. Lippkow, H. H. Strehblow, Electrochim. Acta 43, 2131 (1998)
H. M. Pathan, C. D. Lokhande, D. P. Amalnerkar, T. Seth, Appl. Surf. Sci. 211, 48 (2003)
R. Cordova et al., J. Phys. Chem. B 109, 3212 (2005)
V. Saltas et al., Surf. Rev. Lett. 7, 235 (2000)
Al-Mamun, A. B. M. O. Islam, Int. J. Mod. Phys. B 18, 3063 (2004)
Al-Mamun, A. B. M. O. Islam, A. H. Bhuiyan, J. Mater. Sci.-Mater. El. 16, 263 (2005)
E. Andrade et al., Nucl. Instrum. Meth. B 161-163,635 (2000)
R. M. A. Azzam, N. M. Bashara, Ellipsometry and polarized light (North-Holland, Amsterdam, 1997)
H. G. Tompkins, A user’s guide to ellipsometry (Academic Press, Boston, 1993)
L. B. Valdes, Proceedings of the IRE 42, 420 (1954)
S. Agilan, D. Mangalaraj, S. K. Narayandass, G. Mohan Rao, Physica B 365, 93 (2005)
J. M. Pawlikowski, Thin Solid Films 127, 29 (1985)
E. E. Khawaja, J. Phys. D Appl. Phys. 9, 1939 (1976)
J. C. Manifacier, J. Gasiot, P. Fillard, J. Phys. E Sci. Instrum. 9, 1002 (1976)
R. S. Mane, B. R. Sankapal, C. D. Lokhande, Mater. Chem. Phys. 64, 215 (2000)
Z. J. Liu and Y. G. Shen, Appl. Phys. Lett. 84, 5121 (2004)
L. Y. Huang, L. Meng, Mat. Sci. Eng. B.-Solid 137, 310 (2007)
P. G. Ganesan, V. D. Das, Mater. Lett. 60, 2059 (2006)
J. Y. W. Seto, J. Appl. Phys. 46, 5247 (1975)
S. S. Lin, J. L. Huang, D. F. Lii, Surf. Coat. Tech. 190, 372 (2005)
S. Christoulakis et al., Appl. Surf. Sci. 252, 5351 (2006)
M. Lakshmi et al., Thin Solid Films 386, 127 (2001)
Author information
Authors and Affiliations
Corresponding author
About this article
Cite this article
Ying Chyi Liew, J., Talib, Z.A., Mahmood, W. et al. Structural, morphology and electrical properties of layered copper selenide thin film. centr.eur.j.phys. 7, 379–384 (2009). https://doi.org/10.2478/s11534-009-0057-1
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.2478/s11534-009-0057-1