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Liquid Filling Method for Nanofluidic Channels Utilizing the High Solubility of CO2

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Abstract

We developed a fabrication method and a liquid filling method for a nano chemical reactor that used Y-shaped nanochannels specially designed for mixing and reacting. In order to reduce the pressure loss and to utilize the characteristics of the nanochannel, inlet microchannels were fabricated just beside the nanochannels. We investigated an initial liquid filling method into the nanochannels that ensured there were no air bubbles that could cause a flow stack due to the capillary pressure. In our method, the micro- and nanochannels were filled with carbon dioxide and any remaining air during the initial liquid introduction was dissolved utilizing the high solubility of carbon dioxide. We propose that chemical reactions in nanospaces can be realized by utilizing these fabrication and liquid introduction techniques.

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Authors and Affiliations

  1. Department of Applied Chemistry, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo, 113-8656, Japan

    Eiichiro Tamaki, Akihide Hibara, Haeng-Boo Kim & Takehiko Kitamori

  2. Micro Chemistry Group, Kanagawa Academy of Science and Technology, 3-2-1 Sakado, Takatsu-ku, Kawasaki-shi, Kanagawa, 213-0012, Japan

    Manabu Tokeshi & Takehiko Kitamori

  3. Department of Engineering Synthesis, School of Engineering, The University of Tokyo, Tokyo, 113-8656, Japan

    Takeshi Ooi & Masayuki Nakao

  4. Core Research for Evolutional Science and Technology, Japan Science and Technology Agency, Japan

    Takehiko Kitamori

Authors
  1. Eiichiro Tamaki
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  2. Akihide Hibara
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  3. Haeng-Boo Kim
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  4. Manabu Tokeshi
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  5. Takeshi Ooi
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  6. Masayuki Nakao
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  7. Takehiko Kitamori
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Corresponding author

Correspondence to Takehiko Kitamori.

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Tamaki, E., Hibara, A., Kim, HB. et al. Liquid Filling Method for Nanofluidic Channels Utilizing the High Solubility of CO2. ANAL. SCI. 22, 529–532 (2006). https://doi.org/10.2116/analsci.22.529

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  • DOI: https://doi.org/10.2116/analsci.22.529

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