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Integrated 60-GHz miniaturized wideband metasurface antenna in a GIPD process

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Abstract

We propose a miniaturized wideband metasurface antenna for 60-GHz antenna-in-package applications. With the glass integrated passive device manufacturing technology, we introduce a coplanar-waveguide-fed (CPW-fed) ring resonator to characterize the material properties of the glass substrate. The proposed antenna is designed on a high dielectric constant glass substrate to achieve antenna miniaturization. Because of the existence of gaps between patch units compared with the conventional rectangular patch in the TM10 mode, the radiation aperture of this proposed antenna is reduced. Located right above the center feeding CPW-fed bow-tie slot, the metasurface patch is realized, supporting the TM10 mode and antiphase TM20 mode simultaneously to improve the bandwidth performance. Using a probe-based antenna measurement setup, the antenna prototype is measured, demonstrating a 10-dB impedance bandwidth from 53.3 to 67 GHz. At 60 GHz, the antenna gain measured is about 5 dBi in the boresight direction with a compact radiation aperture of 0.31λ×0.31λ0 and a thickness of 0.06λ0.

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Correspondence to Lian-ming Li.

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Project supported by the National Key R&D Program of China (Nos. 2018YFE0205900 and 2016YFC0800400), the National Science and Technology Major Project, China (No. 2018ZX03001008), and the National Natural Science Foundation of China (Nos. 61306030 and 61674037)

Contributors

Hai-yang XIA designed the research. Hai-yang XIA and Jin-can HU processed the data. Hai-yang XIA wrote the first draft of the manuscript. Tao ZHANG and Lian-ming LI helped organize the manuscript. Hai-yang XIA, Lian-ming LI, and Fu-chun ZHENG revised and edited the final version.

Compliance with ethics guidelines

Hai-yang XIA, Jin-can HU, Tao ZHANG, Lian-ming LI, and Fu-chun ZHENG declare that they have no conflict of interest.

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Xia, Hy., Hu, Jc., Zhang, T. et al. Integrated 60-GHz miniaturized wideband metasurface antenna in a GIPD process. Front Inform Technol Electron Eng 21, 174–181 (2020). https://doi.org/10.1631/FITEE.1900453

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  • DOI: https://doi.org/10.1631/FITEE.1900453

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