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Modulating nanostructures in metals by magneton sputtering

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Abstract

Here, we report an effective nanostructures modulation strategy by W alloying and annealing treatment in Cu films deposited by magnetron sputtering. The as-deposited Cu and Cu–W films exhibit nanograins with comparable grain sizes. After annealing, nanograins in the Cu film are substantially coarsened accompanying with nano-twinned structure formation. While nanograins survive in annealed Cu–W films due to the pinning effect of W atoms on grain boundary migration. By increasing W content and/or annealing temperature, W particles segregation intensifies, and hybrid nanostructures are formed composed of nanoparticles and nanograins. Our findings can provide strategical guidance for fabricating high-performance nanostructured materials.

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Analyzed and raw data relevant to this study are available from the corresponding author upon reasonable requests.

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Acknowledgments

The authors acknowledge financial support from the Ministry of Science and Technology of China (Grants 2017YFA0700702, 2017YFA0700705), the National Natural Science Foundation of China (Grants 52073290, 51927803), Science Fund for Distinguished Young Scholars of Liaoning Province (Grant 2023JH6/100500004), the Postdoctoral Scientific Research Foundation of Shenyang Ligong University, and the Doctoral Research Foundation Project of Liaoning Science and Technology Department (Grant 2022-BS-184).

Funding

This study is supported by the Ministry of Science and Technology of China (Grants 2017YFA0700702, 2017YFA0700705), the National Natural Science Foundation of China (Grants 52073290, 51927803), Science Fund for Distinguished Young Scholars of Liaoning Province (Grant 2023JH6/100500004), the Postdoctoral Scientific Research Foundation of Shenyang Ligong University, and the Doctoral Research Foundation Project of Liaoning Science and Technology Department (Grant 2022-BS-184).

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Correspondence to Kaiping Tai.

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Mao, P., Cheng, Z., Yu, Z. et al. Modulating nanostructures in metals by magneton sputtering. MRS Communications 13, 492–499 (2023). https://doi.org/10.1557/s43579-023-00366-x

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