Abstract
This study focuses on the formulation of copper paste with optimal properties to micro-extrude porous Cu heat sinks, using extrusion additive manufacturing. The influence of the debinding and sintering conditions on the porosity level and the heat dissipation behavior has been investigated. Open air debinding leads to a density increases from 200 up to 400°C, then decreases from 400 down to 600°C. This behavior is a result from a competition between densification and the oxidation. Heat dissipation of the copper heat sink increases with respect to the porosity ratio of the sintered part.
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All data generated or analyzed during this study are included in this published article.
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Acknowledgments
The authors would like to thanks Eric Lebraud of the Institut de Chimie de la Matière Condensée de Bordeaux for performing the XRD analyses.
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This research did not receive any specific grant from funding from funding agencies in the public, commercial, or not-for-profit sectors.
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Silvain, JF., Boumali, H., Bourret, J. et al. Porous 3D Cu structures with adaptive heat dissipation properties. MRS Communications 12, 753–758 (2022). https://doi.org/10.1557/s43579-022-00224-2
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DOI: https://doi.org/10.1557/s43579-022-00224-2