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Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application

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Abstract

The present study aims to develop a systematic processing route using direct ink writing (DIW) and pressureless sintering for fabricating hierarchically porous \(\text{ Cu }\) (HP-\(\text{ Cu }\)) electrodes. A 3D printable high particle loading \(\text{ Cu }\) ink \(> 95 {\text{wt}}\%\) with polylactic acid as a binder was prepared. Green \({\text{Cu}}\) samples using optimum value of \(\text{ Cu }\) loading, nozzle diameter, layer height, and printing speed as 97 \({\text{wt}}\%\), 0.2 \(\text{mm}\), 70% and 10 \(\text{mm}/\text{s}\) respectively were fabricated and subsequently sintered. A proper inter-particle bonding with 91% relative density and 215 \(\text{Mpa}\) ultimate compressive strength was achieved. Finally, a proof-of-concept study targeting the fabrication of thin HP-\(\text{ Cu }\) current collector was performed and the pore size of 154 ± 10 µm with a thickness of 200 µm was achieved successfully. Moreover, the prepared sample exhibited the highest coulombic efficiency of 95.86% for more than 400 h at 1 \({\text{mAcm}}^{-2}\) making it a potential candidate for energy storage applications.

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Funding

This work is supported by the Department of Science and Technology-Science and Engineering Research Board (DST-SERB), New Delhi, India (Grant reference no. CRG/2023/003836).

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Authors and Affiliations

  1. Department of Mechanical Engineering, Indian Institute of Technology Banaras Hindu University Varanasi, Varanasi, UP, India

    Vivek Mani Tripathi, Pawan Sharma & Rajnesh Tyagi

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  1. Vivek Mani Tripathi
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  2. Pawan Sharma
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  3. Rajnesh Tyagi
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Contributions

Vivek Mani Tripathi—writing original draft, investigation, visualization & conceptualization. Pawan Sharma—supervision, conceptualization, writing& editing. Rajnesh Tyagi—supervision, review & editing.

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Correspondence to Pawan Sharma.

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Tripathi, V.M., Sharma, P. & Tyagi, R. Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application. Journal of Materials Research (2024). https://doi.org/10.1557/s43578-024-01436-z

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