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Low-temperature annealing of 2D Ti3C2Tx MXene films using electron wind force in ambient conditions

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Abstract

Two-dimensional transition metal carbides and nitrides, known as MXenes, are layered materials with unique functionalities which make them suitable for applications such as energy storage devices, supercapacitors, electromagnetic interference shielding, and wireless communications. Since they are wet-processed, MXenes need annealing to improve their electrical conductivity. The extent of annealing highly depends on temperature; however, higher temperatures can also impact the resulting phases and structure. In this study, we present a non-thermal annealing process utilizing an electron wind force (EWF) method in ambient conditions. This process is demonstrated on freestanding Ti3C2Tx films, where we show up to 70% decrease in resistivity at temperatures below 120 °C compared to conventional thermal annealing methods. MXene structures before and after annealing are analyzed using Raman spectroscopy and ex situ and in situ X-ray diffraction. Surface terminations and intra-flake defects modification in Ti3C2Tx layers after EWF annealing impart better electrical conductivity to MXene film than the non-annealed films.

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Acknowledgments

MAH gratefully acknowledges the support from the Division of Civil, Mechanical, & Manufacturing Innovation (Nanomanufacturing program) of the National Science Foundation through award # 1760931. BA acknowledges the support from Indiana University Research Support Funds Grant (RSFG) and startup funding from the Department of Mechanical and Energy Engineering and Purdue School of Engineering and Technology at IUPUI. We would like to also acknowledge the use of Bruker XRD equipment, which was awarded through NSF grant MRI-1429241. The help of Ms. Krista Pulley with Ti3C2Tx synthesis is greatly appreciated.

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Rasel, M.A.J., Wyatt, B., Wetherington, M. et al. Low-temperature annealing of 2D Ti3C2Tx MXene films using electron wind force in ambient conditions. Journal of Materials Research 36, 3398–3406 (2021). https://doi.org/10.1557/s43578-021-00373-5

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  • DOI: https://doi.org/10.1557/s43578-021-00373-5

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