Abstract
Non-isothermal curing kinetics of DGEBA/PLA/MTHPA compounds was modeled using Ozawa, Kissinger, Friedman autocatalytic, Friedman and Málek models, whose parameters and associate deviation are reported. Ozawa and Kissinger consider global Ea over the whole conversion, estimated as 65.0 kJ/mol with R2 0.8393 and 87.60; these low R2 are due to the several stages during curing with distinct energy needs which most likely conducted to the discrepancies that should not be ignored; nevertheless, the average Ea might be adopted for the curing understanding, whereas adding PLA subtly increases Ea. Málek’s model adequately described the kinetics processes as also did isoconversional and autocatalytic Friedman models which presented R2 > 0.99. PLA’s molecular chains behaved as curing impediments, and during its progress, it is hypothesized that they increase the system’s swollen coils and eventually an interconnected structure that percolates the system results in (macro) gelation instead cross-linking; additionally, hydrogen bonds between PLA–DGEBA promote competitive reactions during reticulation.
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Acknowledgments
The authors would like to thank Olin Corporation (Brazil) for kindly supplying the reactants. The authors are deeply grateful for the reading and discussions from Professor Tomas Jeferson de Mélo and Professor Pankaj Agrawal. The authors thank Prof. Dr. Marcelo Sobral da Silva, Prof. Dr. Josean Fechine Tavares, coordinators of the Multi-User Characterization and Analysis Laboratory—LMCA in UFPB, and Dr. Marcelo Felipe Rodrigues da Silva for the Nuclear Magnetic Resonance—NMR spectra.
Funding
The authors would like to acknowledge the financial support from the Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES), from Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) and Fundação de Apoio à Pesquisa do Estado da Paraíba (FAPESQ) (Concession term: 017/2019). Professor Renate Wellen is CNPq fellow (Number: 307488/2018-7).
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Silva, I.D.S., Barros, J.J.P., Jaques, N.G. et al. On the curing kinetics of epoxy/PLA compounds. Journal of Materials Research 36, 2973–2986 (2021). https://doi.org/10.1557/s43578-021-00234-1
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DOI: https://doi.org/10.1557/s43578-021-00234-1