Abstract
In this article, we discuss creep deformation as it relates to thin films and multilayer foils. We begin by reviewing experimental techniques for studying creep deformation in thin-film geometries, listing the pros and cons of each; then we discuss the use of deformation-mechanism maps for recording and understanding observed creep behavior. We include a number of cautionary remarks regarding the impact of microstructural stability, zero-creep stresses, and transient-creep strains on stress-strain rate relationships, and we finish by reviewing the current state of knowledge for creep deformation in thin films. This includes both thin films that are heated on substrates as well as multilayer films that are tested as freestanding foils.
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SchiøJ. tz, T. Vegge, F.D. Di Tolla, and K.W. Jacobsen, Phys. Rev. B 60 (1999) p. 11971.
W.N. Sharpe, B. Yuan, and R.L. Edwards, J. Microelectromech. Sys. 6 (1997) p. 193.
O. Kraft and C.A. Volkert, Adv. Eng. Mater. 3 (2001) p. 99.
T.P. Weihs, S. Hong, J.C. Bravman, and W.D. Nix, J. Mater. Res. 3 (1988) p. 931.
W.D. Nix, Metall. Trans. A 20A (1989) p. 2217.
M. Hommel, O. Kraft, and E. Arzt, J. Mater. Res. 14 (1999) p. 2373.
A.G. Atkins, A. Silverio, and D. Tabor, J. Inst. Met. 94 (1966) p. 369.
S.N.G. Chu and J.C.M. Li, J. Mater. Sci. 12 (1977) p. 2200.
D. Stone, W.R. Lafontaine, P. Alexopoulos, and C.Y. Li, J. Mater. Res. 3 (1988) p. 141.
V. Raman and R. Berriche, J. Mater. Res. 7 (1992) p. 627.
M.D. Thouless, Acta Metall. Mater. 41 (1993) p. 1057.
K.T. Miller, F.F. Lange, and D.B. Marshall, J. Mater. Res. 5 (1990) p. 151.
F.Y. Genin, W.W. Mullins, and P. Wynblatt, Acta Metall. Mater. 40 (1992) p. 3239.
D.J. Srolovitz and S.A. Safran, J. Appl. Phys. 60 (1986) p. 247.
D.J. Srolovitz and S.A. Safran, J. Appl. Phys. 60 (1986) p. 255.
D. Josell and W.C. Carter, in Creep and Stress Relaxation in Miniature Structures and Components, edited by H.D. Merchant (The Minerals, Metals, and Materials Society, Warrendale, PA, 1996) p. 271.
D. Josell, S.R. Coriell, and Mc G.B. Fadden, Acta Metall. Mater. 43 (1995) p. 1987.
J.P. Fain, R. Banerjee, D. Josell, P.M. Anderson, H. Fraser, N. Tymiak, and W. Gerberich, in Nanophase and Nanocomposite Materials III, edited by S. Komarneni, J.C. Parker, and H. Hahn (Mater. Res. Soc. Symp. Proc. 581, Warrendale, PA, 2000) p. 603.
D. Josell, W.C. Carter, and J.E. Bonevich, Nanostruct. Mater. 12 (1999) p. 387.
A.C. Lewis, A.B. Mann, D. Josell, J. Tapson, and T.P. Weihs, in Interfacial Engineering for Optimized Properties II, edited by C.B. Carter, E.L. Hall, S.R. Nutt, and C.L. Briant (Mater. Res. Soc. Symp. Proc. 586, Warrendale, PA, 2000) p. 249.
T.H. Courtney, Mechanical Behavior of Materials (McGraw-Hill, New York, 2000).
G.B. Gibbs, Philos. Mag. 13 (1966) p. 589.
H.J. Frost and M.F. Ashby, Deformation-Mechanism Maps: The Plasticity and Creep of Metals and Ceramics (Pergamon Press, New York, 1982).
D. Josell and F. Spaepen, Acta Metall. Mater. 41 (1993) p. 3007.
D. Josell and F. Spaepen, Acta Metall. Mater. 41 (1993) p. 3017.
D. Josell and Z.L. Wang, in Thin Films: Stresses and Mechanical Properties V, edited by S.P. Baker, C.A. Ross, P.H. Townsend, C.A. Volkert, and BøP. rgesen (Mater. Res. Soc. Symp. Proc. 356, Pittsburgh, 1995) p. 357.
K.E. Harris and A.H. King, Acta Mater. 46 (1998) p. 6195.
A.C. Lewis, A.B. Mann, D. van Heerden, D. Josell, and T.P. Weihs, in Influences of Interface and Dislocation Behavior on Microstructure Evolution, edited by M. Aindow, M.D. Asta, M.V. Glazov, D.L. Medlin, A.D. Rollet, and M. Zaiser (Mater. Res. Soc. Symp. Proc. 652, Warrendale, PA, 2001) p. Y1.3.1.
C.H. Shang, R.C. Cammarata, C.L. Chien, and T.P. Weihs, Acta. Mater. (2001) to be submitted.
O.D. Sherby and P.M. Burke, Prog. Mater. Sci. 13 (1968) p. 325.
F.R. Brotzen, C.T. Rosenmayer, C.G. Cofer, and R.J. Gale, Vacuum 41 (1990) p. 1287.
M.D. Thouless, J. Gupta, and J.M.E. Harper, J. Mater. Res. 8 (1993) p. 1845.
R.-M. Keller, S.P. Baker, and E. Arzt, Acta Mater. 47 (1999) p. 415.
E. Arzt, G. Dehm, P. Gumbsch, O. Kraft, and D. Weiss, Prog. Mater. Sci. 46 (2001) p. 283.
D. Weiss, H. Gao, and E. Arzt, Acta Mater. 49 (2001) p. 2395.
H. Gao, L. Zhang, W.D. Nix, C.V. Thompson, and E. Arzt, Acta Mater. 47 (1999) p. 2865.
Y.-L. Shen and S. Suresh, Acta Metall. Mater. 43 (1995) p. 3915.
Y.-L. Shen and S. Suresh, J. Mater. Res. 10 (1995) p. 1200.
Y.-L. Shen and S. Suresh, Acta Mater. 44 (1996) p. 1337.
V. Pelosin and J. Hillairet, Nanostruct. Mater. 4 (1994) p. 229.
V. Pelosin, J. Hillairet, and B. Rodmacq, J. Phys.: Condens. Matter 6 (1994) p. 1099. Strain rate obtained from creep data in Figure 8.
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Josell, D., Weihs, T.P. & Gao, H. Diffusional Creep: Stresses and Strain Rates in Thin Films and Multilayers. MRS Bulletin 27, 39–44 (2002). https://doi.org/10.1557/mrs2002.18
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DOI: https://doi.org/10.1557/mrs2002.18