Skip to main content
Log in

Integrated MEMS Technologies

  • Published:
MRS Bulletin Aims and scope Submit manuscript

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

References

  1. J.H. Smith S. Montague J.J. Sniegowski J.R. Murray and P.J. McWhorter “Embedded Mi-cromechanical Devices for the Monolithic Integration of MEMS with CMOS,” Proc. IEDM 1995 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1995) p.609.

    Google Scholar 

  2. J.T. Kung U.S. Patent No.5,504,026 (April 2, 1996).

    Google Scholar 

  3. H.C. Nathanson W.E. Newell R.A. Wickstrom and J.R. Davis Jr., IEEE Trans. Electron Devices ED-14 (1967) p.117.

    Google Scholar 

  4. R.T. Howe and R.S. Muller “Integrated Resonant-Microbridge Vapor Sensor,” Proc. IEEE IEDM 1984 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1984) p.213.

    Google Scholar 

  5. T.A. Core W.K. Tsang and S.J. Sherman Solid State Technol. 36 (10) (1993) p.39.

    Google Scholar 

  6. M. Offenberg F. Lamer B. Elsner H. Munzel and W. Riethmuller in Tech. Digest 8th Int. Conf. on Solid-State Sensors and Actuators/Eurosensors IX, Vol. 1 (Institute of Electrical and Electronics Engineers Piscataway, NJ, 1995) p.589.

    Google Scholar 

  7. T.J. Brosnihan J.M. Bustillo A.P. Pisano and R.T. Howe “Embedded Interconnect and Electrical Isolation for High-Aspect-Ratio, SOI Inertial Instruments,” Tech. Digest 1997 Int. Conf. on Solid-State Sensors and Actuators (Transducers’ 97), Vol. 1 (1997) p.637.

    Google Scholar 

  8. L. Parameswaran C. Hsu and M.A. Schmidt “A Merged MEMS-CMOS Process Using Silicon Wafer Bonding,” Proc. IEDM 1995 (Institute of Electrical and Electronics Engineers, Piscataway, NJ) p.613.

  9. H. Baltes and O. Brand IEEE AES Sys. Mag. 14 (1999) p.29.

    Google Scholar 

  10. H. Xie L. Erdmann X. Zhu K. Gabriel and G. Fedder “Post-CMOS Processing for High-Aspect-Ratio Integrated Silicon Microstructures,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 2000) p.77.

    Google Scholar 

  11. K.A. Shaw and N.C. MacDonald in Proc. IEEE 9th Int. Workshop on MEMS (Institute of Electrical and Electronics Engineers, Piscat-away, NJ, 1996) p.44.

    Google Scholar 

  12. P.F. Van Kessel, L.J. Hornbeck R.E. Meier and M.R. Douglass in Proc. IEEE 86 (1998) p.1687.

    Google Scholar 

  13. M.W. Putty and K. Najafi “A Microma-chined Vibrating Ring Gyroscope,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 1994), p. 213.

    Google Scholar 

  14. M.S. Rodgers and J.J. Sniegowski “5-Level Polysilicon Surface Micromachine Technology: Application to Complex Mechanical Systems,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 1998) p.144.

    Google Scholar 

  15. S. Sedky P. Fiorini M. Caymax S. Loreti K. Baert L. Hermans and R. Mertens IEEE/ASME J.MEMS 7 (1998) p.365.

    Google Scholar 

  16. B. Li B. Xiong L. Jiang Y. Zohar and M. Wong IEEE/ASME J.MEMS 8 (1999) p.366.

    Google Scholar 

  17. A.E. Franke D. Bilic D.T. Chang P.T. Jones T.J. King R.T. Howe and G.C. Johnson Tech. Digest IEEE Int. MEMS’ 99 Conference (Institute of Electrical and Electronics Engineers, Piscat-away, NJ, 1999) p.630.

    Google Scholar 

  18. A.E. Franke Y. Jiao M.T. Wu T.J. King and R.T. Howe “Post-CMOS Modular Integration of Poly-SiGe Microstructures Using Poly-Ge Sacrificial Layers,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 2000) p.18.

    Google Scholar 

  19. J.M. Heck C.G. Keller A.E. Franke L. Muller T.J. King and R.T. Howe in Proc. 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers ’99), Vol. 1 (Institute of Electrical Engineers of Japan, Sendai, 1999) p. 328.

    Google Scholar 

Download references

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Franke, A.E., King, TJ. & Howe, R.T. Integrated MEMS Technologies. MRS Bulletin 26, 291–295 (2001). https://doi.org/10.1557/mrs2001.62

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/mrs2001.62

Navigation