Abstract
A method for extracting the substrate-independent stress–strain curves of thin films was developed using spherical nanoindentation to investigate the yield behavior of diamond-like carbon (DLC) thin films with Young’s moduli of ∼73 GPa and ∼76 GPa. The resulting stress–strain curves showed that these films commence yielding at ∼13 GPa and ∼14 GPa, respectively. These yield strength values agree with the critical pressure necessary to initiate the transformation of sp2-bonded carbon into significantly harder sp3-bonded carbon, indicating that the yielding of the materials is associated with the sp2-to-sp3 phase transition. The ability of a DLC film to accommodate a progressively increasing contact stress with strain beyond the yield point while dissipating part of the accumulated strain energy, as evidenced in this work, implies a unique mechanism of the brittle material for passively mitigating contact deformation and fracture in tribological applications.
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ACKNOWLEDGMENTS
This study was supported by Global Frontier Program through the Global Frontier Hybrid Interface Materials (GFHIM) of the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning (2013M3A6B1078873 and 2013M3A6B1078874). The authors also acknowledge support from Hysitron, Inc. on the state-of-the-art TI 950 TriboIndenter® nanomechanical test instrument used for this work.
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Fujisawa, N., Zhang, T.F., Li, O.L. et al. Substrate-independent stress–strain behavior of diamond-like carbon thin films by nanoindentation with a spherical tip. Journal of Materials Research 33, 699–708 (2018). https://doi.org/10.1557/jmr.2018.45
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DOI: https://doi.org/10.1557/jmr.2018.45