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Relationship between the MgOp/Cu interfacial bonding state and the arc erosion resistance of MgO/Cu composites

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Abstract

MgO/Cu composites containing a 1.0% volume fraction of MgO particles were prepared by internal oxidation and powder metallurgy, respectively. The interfacial bonding state between the MgO particles and Cu matrix was characterized by scanning electron microscopy and transmission electron microscopy. The effect of the MgOp/Cu interfacial bonding state on the arc erosion resistance of the MgO/Cu composites was investigated, and the arc erosion resistance was examined using a JF04C electrical composite testing system. The results indicate that the 1.0 vol% MgO/Cu composite with a semicoherent MgOp/Cu interface experiences a lower arc erosion rate and smaller fluctuations of arcing energy than those of the 1.0 vol% MgO/Cu composite with an incoherent MgOp/Cu interface. Erosion morphology observations further indicate that a solid to liquid phase transformation occurs under arcing and MgO particles dispersed in the molten copper both prevent the copper matrix from splashing and enhance the arc erosion resistance of the MgO/Cu composites. While the shallow electric erosion pits are distributed uniformly on the arc surface of the MgO/Cu composites with a semicoherent interface, the MgO/Cu composite with an incoherent interface has deep and uneven pits on its arc surface, characterized by large electric erosion molten droplets.

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ACKNOWLEDGMENTS

This research is supported by the National Natural Science Foundation of China (No. 51605146 and No. U1502274), the International Scientific and Technological Cooperation Project of Henan Province (No. 172102410046), Key Science and Technology Program of Henan Province (No. 172102410046), and the fund of the Guangdong Provincial Key Laboratory for Technology and Application of Metal Toughening (GKL201601).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China

    Xiuhua Guo, Kexing Song, Yanjun Zhou & Xu Wang

  2. Collaborative Innovation Center of Nonferrous Metals, Henan Province, Luoyang, 471023, China

    Xiuhua Guo, Kexing Song, Yanjun Zhou & Xu Wang

  3. School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, People’s Republic of China

    Shuhua Liang

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  1. Xiuhua Guo
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  2. Kexing Song
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  4. Yanjun Zhou
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  5. Xu Wang
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Correspondence to Xiuhua Guo.

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Guo, X., Song, K., Liang, S. et al. Relationship between the MgOp/Cu interfacial bonding state and the arc erosion resistance of MgO/Cu composites. Journal of Materials Research 32, 3753–3760 (2017). https://doi.org/10.1557/jmr.2017.321

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  • DOI: https://doi.org/10.1557/jmr.2017.321

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