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Study of layered diamond like carbon and PECVD fluorocarbon films for ultra low dielectric constant interlayer dielectric applications

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Abstract

Diamond like carbon (DLC) films deposited using CH4 and Ar and amorphous fluorocarbon (a:C-F) films deposited using CF4 and Si2H6 as precursors were optimized for ultra-low dielectric constant applications by tuning pressure, substrate temperature, and flow rate ratio. Sixty three films belonging to three stack configurations possessed good morphology and adhesion post DLC deposition. Structural and mechanical properties with respect to film integrity, adhesion, roughness, and shrinkage rate were studied. Internal and interface stress distribution results in the increased stability of as deposited DLC–a:C-F–DLC sandwich layers in comparison to a:C-F–DLC stacks. Annealed a:C-F with DLC top coat and As deposited a:C-F are similar in bonding structure. Failure mode is buckling delamination failure with increasing severity in films with higher oxygen incorporation and can be preserved by annealing the fluorocarbon component or providing a DLC base coat. Effect of process parameters on properties relevant to integration has been determined.

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ACKNOWLEDGMENTS

The authors are sincerely grateful to the personnel at the University of Texas at Dallas (UTD) for their assistance. This work was partially supported by Lockheed Martin and UTD.

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Authors and Affiliations

  1. C&D Semiconductor, San Jose, California, 95131, USA

    Nandini G. Sundaram

  2. Lam Research Corporation, Fremont, California, 94538, USA

    Seetharaman Ramachandran

  3. The University of Texas at Dallas, Richardson, Texas, 75083, USA

    Lawrence Overzet, Matthew Goeckner & Gil-Sik Lee

Authors
  1. Nandini G. Sundaram
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  2. Seetharaman Ramachandran
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  3. Lawrence Overzet
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  4. Matthew Goeckner
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  5. Gil-Sik Lee
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Correspondence to Nandini G. Sundaram.

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Sundaram, N.G., Ramachandran, S., Overzet, L. et al. Study of layered diamond like carbon and PECVD fluorocarbon films for ultra low dielectric constant interlayer dielectric applications. Journal of Materials Research 31, 1027–1037 (2016). https://doi.org/10.1557/jmr.2016.97

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  • DOI: https://doi.org/10.1557/jmr.2016.97

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