Skip to main content
Log in

Effects of B and Y additions on the microstructure and properties of Cu–Mg–Te alloys

  • Published:
Journal of Materials Research Aims and scope Submit manuscript

Abstract

Compound effects of B and Y additions on the microstructures and properties of a new type of high-strength and high-conductivity (HSHC) Cu–Mg–Te alloys are investigated on the aspects of purification and precipitation. Because of the purification function of B and Y additions, the tensile strength increased superlatively by the amplitude of 21.7% with a similar increase of elongation and the electrical conductivity of 4.2%. By comparison of the calculated decomposition pressures of B2O3 and Y2O3 at different temperatures, it can be concluded that the boron oxide is more stable than the yttrium oxide in the copper liquid, indicating the superior deoxygenization purification of the rare earth yttrium. The dispersive distribution of the Y–B compounds (YB6) was another factor for the improvement of the mechanical properties of the copper alloy. Finally, the copper alloy treated by hot rolling, cold rolling, and annealing processes in sequence exhibits HSHC with the tensile strength of 610.7 MPa and the electrical conductivity of 53.1%IACS.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

FIG. 1.
FIG. 2.
TABLE I.
TABLE II.
FIG. 3.
FIG. 4.
TABLE III.
FIG. 5.

Similar content being viewed by others

References

  1. M. Li, J.K. Heuer, J.F. Stubbins, and D.J. Edwards: Fracture behavior of high-strength, high-conductivity copper alloys. J. Nucl. Mater. 283–287, 977 (2000).

    Article  Google Scholar 

  2. R. Liu, H. Tao, X. Zhou, D. Lu, K. Liu, Q. Peng, Y. Peng, and F. Zhong: Present situation and future prospect of high-strength and high-conductivity Cu alloy. Mater. Rev. 26(10), 100 (2012).

    Google Scholar 

  3. C.R.F. Azevedo and A. Sinatora: Failure analysis of a railway copper contact strip. Eng. Fail. Anal. 11, 829 (2004).

    Article  CAS  Google Scholar 

  4. Q. Zhang and W. Song: The research and development of copper and copper alloy contact wires and messenger wires. Modern Urban Transit 2, 18 (2004).

    Google Scholar 

  5. Y. Zhao, P. Liu, X. Liu, X. Chen, F. Ma, W. Li, and D. He: Research Progress and application of contact wire for high-speed electric railway. Mater. Rev. 26(3), 46 (2012).

    Google Scholar 

  6. Y. Shen, Z. Fu, G. Zhang, J. Kong, J. Zhang, M. Liu, J. Hu, S. Wang, and M. Xie: Researching prospect and developing tendency on high-strength and high-conductivity copper-silver alloys. Mater. Rev. 26(13), 109 (2012).

    CAS  Google Scholar 

  7. A. Zilly, U. Christian, S. Kött, D. Nobiling, and N. Jost: Production and metallographic examination of precipitable Cu-Mg alloys. Pract. Metallogr. 48(11), 582 (2011).

    Article  CAS  Google Scholar 

  8. C. Wu: Copper-Magnesium alloy contact wire with high strength. J. Railway Eng. Soc. 13(4), 99 (1996).

    Google Scholar 

  9. I. Saglam, D. Özyürek, and K. Çetinkaya: Effect of ageing treatment on wear properties and electrical conductivity of Cu-Cr-Zr alloy. Bull. Mater. Sci. 34(7), 1465 (2011).

    Article  CAS  Google Scholar 

  10. D. Lu, J. Wang, W. Zeng, Y. Liu, L. Lu, and B. Sun: Study on high-strength and high-conductivity Cu–Fe–P alloy. Mater. Sci. Eng., A 421(1–2), 254 (2006).

    Article  Google Scholar 

  11. R. Monzen and C. Watanabe: Microstructure and mechanical properties of Cu-Ni-Si alloys. Mater. Sci. Eng., A 483–484(15), 117 (2008).

    Article  Google Scholar 

  12. W. Ruan and G. Xie: Introduction to independent innovation of China’s high-speed rail contact line technology. China Invention & Patent 8, 48 (2011).

    Google Scholar 

  13. K. Maki, Y. Ito, H. Matsumaga, and H. Mori: Solid-solution copper alloys with high strength and high electrical conductivity. Scr. Mater. 68(10), 777 (2013).

    Article  CAS  Google Scholar 

  14. S. Louadi, A. Yassin, H. Bros, and R. Castanet: Thermodynamic investigation of the Ag-Te and Cu-Te eutectic alloys. J. Alloys Compd. 224, 351 (1995).

    Article  CAS  Google Scholar 

  15. H. Li, S. Xie, X. Zhu, Y. Liu, P. Wu, and L. Cheng: Influence of cerium and yttrium on Cu-Cr-Zr alloys. J. Rare Earths 24, 367 (2006).

    Article  Google Scholar 

  16. D. Lu, J. Wang, L. Lu, Y. Liu, S. Xie, and B. Sun: Effect of B and Ce on microstructures and properties of Cu-Fe-P alloy. J. Chin. Rare Earth Soc. 24(4), 475 (2006).

    CAS  Google Scholar 

  17. Z. Zhuo, H. Ni, and B. Sun: The contrast of refining effects on copper by rare earth and boron. Foundry 51(7), 435 (2002).

    Google Scholar 

  18. S. Zhou, B. Zhao, Z. Zhao, and X. Jin: Application of lanthanum in high strength and high conductivity copper alloys. J. Rare Earths 24, 385 (2006).

    Article  Google Scholar 

  19. T.W. Ellis, I.E. Anderson, H.L. Downing, and J.D. Verhoeven: Deformation-processed wire prepared from gas-atomized Cu-Nb alloy powders. Metall. Mater. Trans. A 24(1), 21 (1993).

    Article  Google Scholar 

  20. D. Ye and J. Hu: Practical Inorganic Thermodynamic Data Handbook (Metallurgical Industry Press, Beijing, 2002).

    Google Scholar 

  21. J. Wang, X. Jiang, and S. Li: Effect of boron on microstructure and properties of copper-based alloys. Chin. J. Mater. Res. 11(4), 381 (1997).

    CAS  Google Scholar 

Download references

Acknowledgments

This research is financially supported by the National Natural Science Foundation of China (Grant No. 50875031) and the Aviation Science Foundation of China (Grant No. 20095263005).

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Xingguo Zhang.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zhang, X., Han, J., Chen, L. et al. Effects of B and Y additions on the microstructure and properties of Cu–Mg–Te alloys. Journal of Materials Research 28, 2747–2752 (2013). https://doi.org/10.1557/jmr.2013.266

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/jmr.2013.266

Navigation