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Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints

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Abstract

Electromigration behavior and fast circuit failure with respect to crystallographic orientation of Sn grains were examined. The test vehicle was Cu/Sn-3.0 wt% Ag-0.5 wt% Cu/Cu ball joints, and the applied current density was 15 kA/cm2 at 160 °C. The experimental results indicate that most of the solder bumps show different microstructural changes with respect to the crystallographic orientation of Sn grains. Fast failure of the bump occurred due to the dissolution of the Cu circuit on the cathode side caused by the fast interstitial diffusion of Cu atoms along the c-axis of the Sn grains when the c-axis was parallel to the electron flow. Slight microstructural changes were observed when the oaxis was perpendicular to the electron flow. In addition, Cu6Sn5 intermetallic compound (IMC) was formed along the direction of the oaxis of the Sn grains instead of the direction of electron flow in all solder ball joints.

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References

  1. P.S. Ho, G. Wang, M. Ding, J.-H. Zhao, and X. Dai: Reliability issues for flip-chip packages. Microelectron. Reliab. 44, 719 (2004).

    Article  Google Scholar 

  2. K.N. Tu: Recent advances on electromigration in very-large-scale-integration of interconnects. J. Appl. Phys. 94, 5451 (2003).

    Article  CAS  Google Scholar 

  3. E.C.C. Yeh, W.J. Choi, and K.N. Tu: Current-crowding-induced electromigration failure in flip chip solder joints. Appl. Phys. Lett. 80, 580 (2002).

    Article  CAS  Google Scholar 

  4. K.N. Tu: Physics and materials challenges for lead-free solders. J. Appl. Phys. 93, 1135 (2003).

    Article  Google Scholar 

  5. Y.C. Chan and D. Yang: Failure mechanisms of solder interconnects under current stressing in advanced electronic packages. Prog. Mater. Sci. 55, 428 (2010).

    Article  CAS  Google Scholar 

  6. B.F. Dyson: Diffusion of gold and silver in tin single crystals. J. Appl. Phys. 37, 2375 (1966).

    Article  CAS  Google Scholar 

  7. B.F. Dyson, T.R. Anthony, and D. Turnbull: Interstitial diffusion of copper in tin. J. Appl. Phys. 38, 3408 (1967).

    Article  CAS  Google Scholar 

  8. F.H. Huang and H.B. Huntington: Diffusion of Sb124, Cd109, Sn113, and Zn65 in tin. Phys. Rev. B. 9, 1479 (1974).

    Article  CAS  Google Scholar 

  9. D.C. Yeh and H.B. Huntington: Extreme fast-diffusion system: Nickel in single-crystal tin. Phys. Rev. Lett. 53, 1469 (1984).

    Article  CAS  Google Scholar 

  10. A.U. Telang, T.R. Bieler, J.P. Lucas, K.N. Subramanian, L.P. Lehman, Y. Xing, and E.J. Cotts: Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys. J. Electron. Mater. 33(12), 1412 (2004).

    Article  CAS  Google Scholar 

  11. M. Lu, D.-Y. Shih, P. Lauro, C. Goldsmith, and D.W. Henderson: Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders. Appl. Phys. Lett. 92,211909(2008).

    Article  Google Scholar 

  12. K. Yamanaka, Y. Tsukada, and K. Suganuma: Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system. Microelectron. Reliab. 47, 1280 (2007).

    Article  CAS  Google Scholar 

  13. JEDEC STANDARD: Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress, JEP154 (2008).

    Google Scholar 

  14. Y.W. Chang, S.W. Liang, and C. Chen: A study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes. Appl. Phys. Lett. 89, 032103 (2006).

    Article  Google Scholar 

  15. K.N. Tu and R.D. Thompson: Kinetics of interfacial reaction in bimetallic Cu-Sn thin film. Acta Metall. 30, 947 (1982).

    Article  CAS  Google Scholar 

  16. J.W. Nah, K.W. Paik, J.O. Suh, and K.N. Tu: Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints. J. Appl. Phys. 94, 7560 (2003).

    Article  CAS  Google Scholar 

  17. E.C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, and H. Balkan: Current-crowding-induced electromigration failure in flip chip solder joints. J. Appl. Phys. 80, 580 (2002).

    CAS  Google Scholar 

  18. J.R. Huang, C.M. Tsai, Y.W. Lin, and C.R. Kao: Pronounced electromigration of Cu in molten Sn-based solders. J. Mater. Res. 23, 250 (2008).

    Article  CAS  Google Scholar 

  19. C.Y. Liu, L. Ke, Y.C. Chuang, and S.J. Wang: Study of electro-migration-induced Cu consumption in the flip-chip Sn/Cu solder bumps. J. Appl. Phys. 100, 083702 (2006).

    Article  Google Scholar 

  20. B. Huntington: Electromigration in metal. In Diffusion in Solids: Recent Developments, edited by A.S. Nowick and J.J. Burton, (Academic, New York, 1979), pp. 303–352.

    Google Scholar 

  21. D. Shangguan: Lead-Free Solder Interconnection (AMS International, Materials Park, OH, 2005), p. 42.

    Google Scholar 

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Authors and Affiliations

  1. Graduate School of Engineering, Osaka University, Ibaraki, Osaka, 567-0047, Japan

    Kiju Lee

  2. Institute of Science and Industrial Research, Osaka University, Ibaraki, Osaka, 567-0047, Japan

    Keun-Soo Kim, Yutaka Tsukada & Katsuaki Suganuma

  3. Kyocera SLC Technologies Corporation, Advanced Packaging Laboratory, Yasu, Shiga, 520-2362, Japan

    Kimihiro Yamanaka

  4. Espec Corporation, Electronic Device System Sales Engineering Department, Kita Ward, Osaka, 530-8550, Japan

    Soichi Kuritani

  5. Senju Metal Industry Co., Ltd., Senjuhasidocho, Tokyo, 270-0021, Japan

    Minoru Ueshima

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  1. Kiju Lee
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Lee, K., Kim, KS., Tsukada, Y. et al. Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints. Journal of Materials Research 26, 467–474 (2011). https://doi.org/10.1557/jmr.2010.86

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  • DOI: https://doi.org/10.1557/jmr.2010.86

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