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Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions

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Abstract

The interfacial reactions in Sn-0.7wt%Cu/ENIG SUS304 couples at 240, 255, and 270 °C are examined in this study. The Ni-containing ternary Cu6Sn5 phase is formed at the Ni/liquid interface in the early reaction stage then it detaches massively from the SUS3O4 substrate and splits into two layers in the molten solder as the reaction time increases. This phase finally disintegrates and disappears. The square pillar-shaped FeSn2 phase is found on top of the SUS3O4 substrate when the Cu6Sn5 layer detaches. The reaction phase formation, detachment, and split mechanisms are proposed. The spalling phenomenon is reviewed and discussed. The growth mechanism of the FeSn2 phase obeys the parabolic law, and the activation energy is determined to be 112.5 KJ/mol.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei Taiwan, 106, Republic of China

    Shih-kang Lin & Yee-wen Yen

  2. Graduate Institute of Engineering, National Taiwan University of Science and Technology, Taipei Taiwan, 106, Republic of China

    Kuen-da Chen & Hao Chen

  3. Department of Chemical and Materials Engineering, Lunghwa University of Science and Technology, Taoyuan County, Taiwan, 33306, Republic of China

    Wei-kai Liou

  4. Graduate Institute of Engineering, National Taiwan University of Science and Technology, Taipei Taiwan, 106, Republic of China

    Yee-wen Yen

  5. Department of Materials Science and Engineering, University of Wisconsin—Madison, Madison, WI, 53706, USA

    Shih-kang Lin

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  1. Shih-kang Lin
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  2. Kuen-da Chen
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  3. Hao Chen
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  4. Wei-kai Liou
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Correspondence to Yee-wen Yen.

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Lin, Sk., Chen, Kd., Chen, H. et al. Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions. Journal of Materials Research 25, 2278–2286 (2010). https://doi.org/10.1557/jmr.2010.0305

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  • DOI: https://doi.org/10.1557/jmr.2010.0305

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