Abstract
The formation of Zn whiskers threatens the reliable operation of electronic equipment with an electrical shorting hazard. As with tin whiskers (much more intensively researched than Zn whiskers), the mechanism of formation is still not clear. This work investigated the Zn whisker growth mechanism for an electroplated Zn coating above a carbon steel substrate from a raised floor tile. Iron–zinc (Fe–Zn) intermetallic and Zn oxides were identified by x-ray diffraction analysis (XRD) and electron probe microanalysis (EPMA). Fe–Zn intermetallic compounds formed on the surface of the Zn layer in addition to the interface between the Zn coating and the steel substrate. Zn oxides formed primarily on the surface of the Zn coating. Fe–Zn intermetallic compounds and Zn oxide formation can be the source of a residual stress that promotes Zn diffusion to the surface of electroplated Zn coating, resulting in the formation of Zn whiskers.
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References
H.L. Cobb: Cadmium whiskers. Monthly Rev. Amer. Electroplaters Soc. 33, (28) 28 (1946)
K.G. Comptom, A. Mendizza, S.M. Arnold: Filamentary growths on metal surfaces “Whiskers”. Corrosion 7, (10) 327 (1951)
G.T. Galyon: A history of tin whisker theory: 1946 to 2004, SMTAI International Conference (Chicago 2004) http://www.nemi.org/projects/ese/tin_whikser_activities.html
J. Smetana: Theory of tin whisker growth: The end game. IEEE Trans-EPM 30, (1) 11 (2007)
S.M. Arnold: The growth of metal whiskers on electrical components, Proceedings of the IEEE Electronic Components Conference(1959) 75–82
U. Lindborg: A model for the spontaneous growth of zinc, cadmium and tin whiskers. Acta Metall. 24, (2) 181 (1976)
K.N. Tu: Copper/tin interfacial reactions: Thin-film case versus bulk case. Mater. Chem. Phys. 46, (2-3) 217 (1996)
S.C. Britton: Spontaneous growth of whiskers on tin coatings. Twenty years of observation. Trans. Inst. Met. Finish. 52 95 (1974)
B-Z. Lee, D.N. Lee: Spontaneous growth mechanism of tin whiskers. Acta Mater. 46, (10) 3701 (1998)
J.W. Osenbach, J.M. DeLucca, B.D. Potterger, A. Amin, R.L. Shook, F.A. Baiocchi: Sn corrosion and its influence on whisker growth. IEEE Trans. Electron. Packag. Manuf. 30, (1) 23 (2007)
U. Lingborg: Observations of the growth of whisker crystals from zinc electroplate. Metall. Trans. A 6( August ) 1581 (1975)
J. Brusse, M. Sampson: Zinc Whiskers: Hidden Cause of Equipment Failure (EEE Computer Society 2004) 43–47
C. Herring, J.K. Galt: Elastic properties of very small specimens. Phys. Rev. 85, (6) 1060 (1952)
E.A. Brandes, G.B. Brook: Smithells Metals Reference Book 7th ed (Butterworth-Heinemann Ltd, Oxford, UK 1992)
http://nepp.nasa.gov/whisker/photos/floor_tile/floor-tile-underside.jpg
B.D. Cullity: Elements of X-ray Diffraction 2nd ed (Addison-Wesley, Reading, MA 1978)
T. Fang, M. Osterman, S. Mathew, M. Pecht: Tin whisker risk assessment. Circuit World 32, (3) 19 (2006)
JEDEC Standard JESD22-A121A Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes (JEDEC Solid State Technology Association 2008)
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Baated, A., Kim, KS. & Suganuma, K. Whisker growth from an electroplated zinc coating. Journal of Materials Research 25, 2175–2182 (2010). https://doi.org/10.1557/jmr.2010.0273
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DOI: https://doi.org/10.1557/jmr.2010.0273