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Improved wettability of Sn-based solder over the Cu60Zr30Ti10 bulk metallic glass surface

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Abstract

The wettability of Pb-free Sn-based solder over the Cu-based Cu60Zr30Ti10 bulk metallic glass surface was investigated. We observed that the as-polished surface was nonwetting for the solder, which was due to the surface oxide layer of ZrOx formed in air. After complete removal of the oxide layer, a thin layer of Ag was deposited on the clean Cu60Zr30Ti10 surface. The Ag-covered Cu60Zr30Ti10 surface showed relatively high resistivity to the reoxidation even in air, and thus the wettability of the Cu60Zr30Ti10 surface for the Sn-based solder was greatly improved.

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Authors and Affiliations

  1. Materials and Structures Laboratory (MSL), Tokyo Institute of Technology, Midori-ku, Yokohama, 226-8503, Japan

    A. Imai, M. Katayama, S. Maruyama & Y. Matsumoto

  2. Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, Osaka, 0047, Japan

    H. Nishikawa, T. Takemoto & A. Inoue

  3. Institute for Materials Research (IMR), Tohoku University, Aoba-ku, Sendai, 980-8577, Japan

    T. Wada, H. Kimura & M. Fukuhara

Authors
  1. A. Imai
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  2. M. Katayama
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  3. S. Maruyama
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  4. H. Nishikawa
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  5. T. Wada
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  6. H. Kimura
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  7. M. Fukuhara
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  8. T. Takemoto
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  9. A. Inoue
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  10. Y. Matsumoto
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Corresponding author

Correspondence to Y. Matsumoto.

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Imai, A., Katayama, M., Maruyama, S. et al. Improved wettability of Sn-based solder over the Cu60Zr30Ti10 bulk metallic glass surface. Journal of Materials Research 24, 2931–2934 (2009). https://doi.org/10.1557/jmr.2009.0343

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  • DOI: https://doi.org/10.1557/jmr.2009.0343

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