Skip to main content
SpringerLink
Log in

Electrochemical corrosion study of Sn–XAg–0.5Cu alloys in 3.5% NaCl solution

  • Published:
Journal of Materials Research Aims and scope Submit manuscript

Abstract

The electrochemical corrosion behavior of Sn–XAg–0.5Cu alloys in 3.5% NaCl solution was examined using potentiodynamic polarization techniques. The Ag content in the alloy was varied from 1 to 4 wt%. The polarization curves obtained for the alloys show an active–passive transition followed by a transpassive region. Sn–XAg–0.5Cu alloys with higher Ag content (>2 wt%) show a strong tendency toward passivation. The passivation behavior has been ascribed to the presence of both SnO and SnO2 on the anode surface. Increase in Ag content from 1 to 4 wt% results in a decrease in the corrosion-current density (Icorr) and linear polarization resistance (LPR) of the alloy. Nevertheless, the corrosion potential (Ecorr) shifts toward negative values, and a decrease in corrosion rate is observed. The presence of Cl− ion initiates pitting and is responsible for the rupture of the passive layer at a certain breakdown potential. The breakdown potential (EBR) decreases and shifts toward more noble values with increase in Ag content in the alloy. Surface analyses by x-ray photoelectron spectroscopy (XPS) and Auger depth profile studies confirmed the formation of both Sn(II) and Sn(IV) oxides in the passive layer.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

TABLE I.
FIG. 1
FIG. 2
FIG. 3
TABLE II.
FIG. 4
FIG. 5
FIG. 6
FIG. 7
FIG. 8
FIG. 9

Similar content being viewed by others

References

  1. J.R. Stack Tin, lead, and tin-lead alloy plating baths. U.S. Patent No. 2313371, March, 1943

    Google Scholar 

  2. M. Carano: Solderability of bright acid chock deposits (aptitude for the soldering of the brilliant tin coatings in acid medium). Plat. Surf. Finish. 70, 58 1983

    CAS  Google Scholar 

  3. R.G. Baker T.A. Pulombo: Plat. Surf. Finish. 70, 63 1983

    CAS  Google Scholar 

  4. J.H. Kim, M.S. Suh H.S. Kwon: Effects of plating conditions on the microstructure of 80 Sn–20 Pb electrodeposits from an organic sulphonate bath. Surf. Coat. Technol. 78, 56 1996

    Article  CAS  Google Scholar 

  5. Y. Liu M. Pritzker: Effect of pulse plating on composition of Sn–Pb coatings deposited in fluoroborate solutions. J. Appl. Electrochem. 33, 1143 2003

    Article  CAS  Google Scholar 

  6. European Parliament Proposal for a Directive of the European Parliament and of the Council on Waste Electrical and Electronic Equipment and the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, (COM 2000) p. 347

  7. Y. Fujiwara, H. Enomoto, T. Nagao H. Hoshika: Composite plating of Sn–Ag alloys for Pb-free soldering. Surf. Coat. Technol. 169–170, 100 2000

    Google Scholar 

  8. J.C. Puippe W. Fluehmann: Electrodeposition and properties of a silver–tin alloy. Plat. Surf. Finish. 70, 46 1983

    CAS  Google Scholar 

  9. N. Kubota E. Sato: The properties of silver–tin alloy deposits from pyrophosphate bath. Electrochim. Acta. 30, 305 1985

    Article  CAS  Google Scholar 

  10. S. Arai, H. Akatsuka N. Kaneko: Sn–Ag solder bump formation for flip-chip bonding by electroplating. J. Electrochem. Soc. 150, 10 2003

    Google Scholar 

  11. S. Arai, N. Kaneko N. Shinohara: Polarographic study on the smoothing of Sn–Ag alloy film electrodeposited from pyrophosphate iodide bath. Electrochemistry 69, 254 2001

    Article  CAS  Google Scholar 

  12. S. Arai T. Watanabe: Microstructure of Sn–Ag alloys electrodeposited from pyrophosphate-iodide solutions. Mater. Trans. 39, 439 1998

    Article  CAS  Google Scholar 

  13. O. Khaselev, I.S. Zavarine, A. Vysotskaya, C. Fan, Y. Zhang J. Abys: Electroplating and properties of Sn Bi and Sn Cu for lead free finishes. Trans. Inst. Met. Finish. 80, 200 2002

    Article  CAS  Google Scholar 

  14. R.K. Shiue, L.W. Tsay, C.L. Lin J.L. Ou: A Study of Sn–Bi–Ag–In lead-free solders. J. Mater. Sci. 38, 1269 2003

    Article  CAS  Google Scholar 

  15. E. Guaus J. Torrent-Burgues: Tin–zinc electrodeposition from sulphate–gluconate baths. J. Electroanal. Chem. 549, 25 2003

    Article  CAS  Google Scholar 

  16. C.M.L. Wu, D.Q. Yu, C.M.T. Law L. Wang: The properties of Sn–9Zn lead free solder alloys doped with trace rare earth elements. J. Electron. Mater. 31, 921 2002

    Article  CAS  Google Scholar 

  17. K.L. Lin L.M. Sun: Electrodeposition of eutectic Sn–Zn alloy by pulse plating. J. Mater. Res. 18, 2203 2003

    Article  CAS  Google Scholar 

  18. N. Kaneko, M. Seki, S. Arai N. Shinohara: Sn–Cu solder bump formation from acid sulfate baths using electroplating method. Electrochemistry 71, 791 2003

    Article  CAS  Google Scholar 

  19. M. Fukuda, K. Imayoshi Y. Matsumoto: Effects of thiourea and polyoxyethylene lauryl ether on electrodeposition of Sn–Ag–Cu alloy as a Pb free solder. J. Electrochem. Soc. 149, C244 2002

    Article  CAS  Google Scholar 

  20. R.K. Shiue, L.W. Tsay, C.L. Lin J.L. Ou: A study of Sn–Bi–Ag–In lead-free solder. J. Mater. Sci. 38, 1269 2003

    Article  CAS  Google Scholar 

  21. T.M. Korhonen J.K. Kivilahti: Thermodynamics of the Sn–In–Ag solder system. J. Electron. Mat. 27, 149 1998

    Article  CAS  Google Scholar 

  22. JEIDA Challenges and Efforts Towards Commercialization of Lead-Free Solder Road Map 2000, Ver. 13, (Japan Electronics Industry Development Association, 2000

    Google Scholar 

  23. J. Bath, C. Handweker E. Bradley: Research update: lead-free solder alternatives. Circ. Assemb. 11, 5, 30 2000

    Google Scholar 

  24. J. Zhao, L. Qi, X. Wang L. Wang: Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead free solder. J. Alloys Compd. 375, 196 2004

    Article  CAS  Google Scholar 

  25. K.S. Kim, S.H. Huh K. Suganuma: Effects of intermetallic compounds on properties of Sn–Ag–Cu lead free soldered joints. J. Alloys Compd. 352, 226 2003

    Article  CAS  Google Scholar 

  26. B.Y. Wu, Y.C. Chan M.O. Alam: Electrochemical corrosion study of Pb-free solders. J. Mater. Res. 21, 62 2006

    Article  CAS  Google Scholar 

  27. H. Oulfajrite, A. Sabbar, M. Boulghallat, A. Jouaiti, R. Lbibb A. Zrinelli: Electrochemical behavior of a new solder material Sn–In–Ag. Mater. Lett. 57, 4368 2003

    Article  CAS  Google Scholar 

  28. K.I. Chen K.L. Lin International Symposium on Electronic Materials and Packaging, Hsinchu, Taiwan. 49 (2002)

  29. E. Adem: VG Scientific Auger Handbook, 1st ed. V.G Scientific Limited East Grinstead, England 1989

    Google Scholar 

  30. Corrosion, Vol. 13, 9th Ed., Metals Handbook ASM International Metals Park, OH 1987

  31. H. Tanaka, F. Ueta, S. Yoshihara T. Shirakashi: Effects of reflow processing and flux residue on ionic migration of lead-free solder plating using the quartz crystal microbalance method. Mater. Trans. 42(9), 3401 2001

    Google Scholar 

  32. S.A.M. Refaey S.S. Abd El-Rehim: Inhibition of chloride pitting corrosion of tin in alkaline and near neutral medium by some inorganic anions. Electrochim. Acta. 42, 667 1997

    Article  CAS  Google Scholar 

  33. J. Kristen: Atlas of metal ligand equilibrium in aqueous solutions. Chester, 1978 623

    Google Scholar 

  34. R. Mishra R. Balasubramanium: Effect of nanocrystalline grain size on the electrochemical and corrosion behavior of nickel. Corros. Sci. 46, 3019 2004

    Article  CAS  Google Scholar 

  35. L. Zhong, H. Zhu, J. Hu, S. Xiao F. Gau: A passivation mechanism of doped polyaniline on 410 stainless steel in de-aerated H2SO4 solution. Electrochim. Acta 51, 5494 2006

    Article  CAS  Google Scholar 

  36. V.B. Singh A. Gupta: Active, passive and transpassive dissolution of In-718 alloy in acidic solutions. Mater. Chem. Phys. 85(1), 12 2004

    Article  CAS  Google Scholar 

  37. A. Kolics, J.C. Polkinghorne A. Wieckowski: Adsorption of sulfate and chloride ions on aluminium. Electrochim. Acta 43, 2605 1998

    Article  CAS  Google Scholar 

  38. J.A. Ricardson G.C. Wood: A study of the pitting corrosion of Al by scanning electron microscopy. Corros. Sci. 10, 313 1970

    Article  Google Scholar 

  39. O. Von Trzebiatowski, J. Janczak T. Sutter: Microelectrochemical corrosion studies on lead free Sn–Ag–Cu solder alloys. Oral presentation at E-MRS Fall meeting, 2005.

  40. T.C. Chang, M.H. Hou, M.C. Wang D.Y. Lin: Electrochemical behaviors of the Sn–9Zn–XAg lead-free solders in a 3.5 wt% NaCl solution. J. Electrochem. Soc. 151(7), C484 2004

    Article  CAS  Google Scholar 

  41. J.F. Moulder, W.F. Stickle, P.E. Sobol K.D. Bomben Handbook of X-Ray Photo Electron Spectroscopy, 2nd ed. Perkin Elmer Corporation Physical Electronics Division 1992

    Google Scholar 

  42. A. Katayama: Electroxidation of methanol on a platinum–tin oxide catalyst. J. Phys. Chem. 84, 376 1980

    Article  CAS  Google Scholar 

  43. R.O. Ansell, T. Dickinson, A.F. Povey P.M.A. Sherwood: X-ray photoelectron spectroscopic studies of tin electrodes after polarization in sodium hydroxide solution. J. Electrochem. Soc. 124(9), 1360 1977

    Article  Google Scholar 

  44. D. Briggs M.P. Seah: Practical Surface Analysis, Publication No. 150, Vol. 1, 2nd ed. (John Wiley and Sons 1993)

  45. T.J. Chuang, C.R. Brundle D.W. Rice: Interpretation of the x-ray photoemission spectra of cobalt oxides and cobalt oxide surfaces. Surf. Sci. 59, 413 1979

    Article  Google Scholar 

  46. F.M. Amanullah, K.J. Pratap V. Hari Babu: Compositional analysis and depth profile studies on undoped and doped tin oxide films prepared by spray technique. Mater. Sci. Eng., A B52, 93 1998

    Article  CAS  Google Scholar 

Download references

Acknowledgment

The authors acknowledge the financial support of this study from the National Science Council of R.O.C under NSC94-2811-E-006-021.

Author information

Authors and Affiliations

  1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, 701, Taiwan, Republic of China

    Udit Surya Mohanty & Kwang-Lung Lin

Authors
  1. Udit Surya Mohanty
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Kwang-Lung Lin
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Kwang-Lung Lin.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Mohanty, U.S., Lin, KL. Electrochemical corrosion study of Sn–XAg–0.5Cu alloys in 3.5% NaCl solution. Journal of Materials Research 22, 2573–2581 (2007). https://doi.org/10.1557/jmr.2007.0328

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/jmr.2007.0328

Search

Navigation