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Damage behavior of Cu–Ta bilayered films under cyclic loading

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Abstract

Damage behavior of Cu–Ta bilayered films bonded to polyimide (PI) substrates has been investigated by cyclic loading tests. Experimental results show that fatigue cracks preferentially initiated in the Ta layer close to the Ta–PI interface and propagated into the Cu layer perpendicular to the interface. The alignment of nanometer-sized Cu grains resulted from the potential GB sliding combined with a small amount of grain rotation was found in the damage zone ahead of the crack tip, and that is suggested to be a likely damage mechanism to accommodate cyclic plastic strain ahead of the fatigue crack tip of the submicrometer-thick Cu layer.

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References

  1. W.D. Nix: Mechanical properties of thin films. Metall. Trans. A 20, 2217 1989

    Article  Google Scholar 

  2. E. Arzt: Size effects in materials due to microstructural and dimensional constraints: A comparative review. Acta Mater. 46, 5611 1998

    Article  CAS  Google Scholar 

  3. S. Suresh: Fatigue of Materials Cambridge University Press Cambridge 1999 44

    Google Scholar 

  4. R. Schwaiger, G. Dehm O. Kraft: Cyclic deformation of polycrystalline Cu films. Philos. Mag. 83, 693 2003

    Article  CAS  Google Scholar 

  5. G.P. Zhang, C.A. Volkert, R. Schwaiger, P. Wellner, E. Arzt O. Kraft: Length-scale-controlled fatigue mechanisms in thin copper films. Acta Mater. 54, 3127 2006

    Article  CAS  Google Scholar 

  6. G.P. Zhang, C.A. Volkert, R. Schwaiger, E. Arzt O. Kraft: Damage behavior of 200-nm thin copper films under cyclic loading. J. Mater. Res. 20, 201 2005

    Article  Google Scholar 

  7. A. Misra, H. Kung, D. Hammon, R.G. Hoagland M. Nastasi: Damage mechanisms in nanolayered metallic composites. Int. J. Damg. Mech. 12, 365 2003

    Article  CAS  Google Scholar 

  8. Y.C. Wang, A. Misra R.G. Hoagland: Fatigue properties of nanoscale Cu/Nb multilayers. Scripta Mater. 54, 1593 2006

    Article  CAS  Google Scholar 

  9. G.P. Zhang, X.F. Zhu, J. Tan Y. Liu: Origin of cracking in nanoscale Cu–Ta multilayers. Appl. Phys. Lett. 89, 041920 2006

    Article  Google Scholar 

  10. P. Catania, R.A. Roy J.J. Cuomo: Phase formation and microstructure changes in tantalum thin films induced by bias sputtering. J. Appl. Phys. 72, 1008 1993

    Article  Google Scholar 

  11. H. Ren M. Sosnowski: Effect of ion irradiation on α and β phase evolution of sputtered tantalum thin films in Thermodynamics and Kinetics of Phase Transformations in Inorganic Materials, edited by C. Ambromeit, P. Bellon, J-L. Bocquet, and D.N. Seidman Mater. Res. Soc. Symp. Proc. 979E, Warrendale, PA 2007 HH11–09

  12. T. Hanlon, E.D. Tabachnikova S. Suresh: Fatigue behavior of nanocrystalline metals and alloys. Int. J. Fatigue 27, 1147 2005

    Article  CAS  Google Scholar 

  13. D. Farkas, M. Willemann B. Hyde: Atomistic mechanisms of fatigue in nanocrystalline metals. Phys. Rev. Lett. 94, 165502 2005

    Article  CAS  Google Scholar 

  14. K. Hattar, J. Han, M.T.A. Saif I.M. Robertson: In situ transmission electron microscopy observations of toughening mechanisms in ultra-fine grained columnar aluminum thin films. J. Mater. Res. 20, 1869 2005

    Article  CAS  Google Scholar 

  15. J. Schiøtz, F.D. Ditolla K.W. Jacobsen: Softening of nanocrystalline metals at very small grain sizes. Nature 391, 561 1998

    Article  Google Scholar 

  16. M.A. Meyers, A. Mishra D.J. Benson: Mechanical properties of nanocrystalline materials. Prog. Mater. Sci. 51, 427 2006

    Article  CAS  Google Scholar 

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Acknowledgments

This work was supported by the National Natural Science Foundation of China (Grant No. 50571103 and No. 50471081), “The Hundred Talent Plan” of the Chinese Academy of Sciences, and the National Basic Research Program of China (Grant No. 2004CB619303).

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Authors and Affiliations

  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, People’s Republic of China

    X. F. Zhu, G. P. Zhang & J. Tan

  2. Nanometrics Inc., Milpitas, California, 95035, USA

    Y. Liu

  3. Department of Intelligent Mechanical Engineering, Fukuoka Institute of Technology, Higashi-ku, Fukuoka, 811-0295, Japan

    S. J. Zhu

Authors
  1. X. F. Zhu
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  2. G. P. Zhang
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  3. J. Tan
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  4. Y. Liu
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  5. S. J. Zhu
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Correspondence to G. P. Zhang.

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Zhu, X.F., Zhang, G.P., Tan, J. et al. Damage behavior of Cu–Ta bilayered films under cyclic loading. Journal of Materials Research 22, 2478–2482 (2007). https://doi.org/10.1557/jmr.2007.0306

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  • DOI: https://doi.org/10.1557/jmr.2007.0306

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