Abstract
The room temperature tensile properties of ultrafine-grained 25-μm gold wires were evaluated as a function of calcium (Ca) doping at various strain rates ranging between 10−3 and 10−1 s−1. Paradoxically, the increased amount of Ca was found to simultaneously increase the strength and ductility of the Au wires. However, based on scanning electron microscopy and tensile characterization, the grain size distributions, strain-hardening rate, and strain rate sensitivity of Au wires did not change with Ca, thus showing that neither grain refinement nor plastic instability are likely to be responsible for the concurrent improvement of strength and ductility.
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Y.M. Wang, E. Ma, and M.W. Chen: Enhanced tensile ductility and toughness in nanostructured Cu. Appl. Phys. Lett. 80, 2395 (2002).
C.C. Koch: Optimization of strength and ductility in nanocrystalline and ultrafine grained metals. Scripta Mater. 49, 657 (2003).
Y.M. Wang and E. Ma: Three strategies to achieve uniform tensile deformation in a nanostructured metal. Acta Mater. 52, 1699 (2004).
R.Z. Valiev and I.V. Alexandrov: Paradox of strength and ductility in metals processed by severe plastic deformation. J. Mater. Res. 17, 5 (2002).
G. He, J. Eckert, W. Loser, and L. Schultz: Novel Ti-base nanostructure-dendrite composite with enhanced plasticity. Nat. Mater. 33, 2 (2003).
A.F. Zimmerman, G. Palumbo, K.T. Aust, and U. Erb: Mechanical properties of nickel silicon carbide nanocomposites. Mater. Sci. Eng., A 328, 137 (2002).
R. Song, D. Ponge, and D. Raabe: Improvement of the work hardening rate of ultrafine grained steels through second phase particles. Scripta Mater. 52, 1075 (2005).
B.B. Sun, M.L. Sui, Y.M. Wang, G. He, J. Eckert, and E. Ma: Ultrafine composite microstructure in a bulk Ti alloy for high strength, strain hardening and tensile ductility. Acta Mater. 54, 1349 (2006).
American Society for Texting Materials Standard Methods: of Testing Fine Round and Flat Wire for Electron Devices and Lamps, F 219, December 10, 1996.
G. Herklotz, L. Schrapler, C. Simons, J. Reuel, and Y.C. Cho: U.S. Patent No. 6,242,106 B1, June 5, 2001.
D.W. Kang: U.S. Patent No. 5,993,735, November 30, 1999.
Q. Wei, S. Cheng, K.T. Ramesh, and E. Ma: Effect of nanocrystalline and ultrafine grain sizes on the strain rate sensitivity and activation volume: fcc versus bcc metals. Mater. Sci. Eng., A 381, 71 (2004).
R. Schwaiger, B. Moser, M. Dao, N. Chollacoop, and S. Suresh: Some critical experiments on the strain-rate sensitivity of nanocrystalline nickel. Acta Mater. 51, 5159 (2003).
L. Lu, S.X. Li, and K. Lu: An abnormal strain rate effect on tensile behavior in nanocrystalline copper. Scripta Mater. 45, 1163 (2001).
F.D. Torre, H.V. Swygenhoven, and M. Victoria: Nanocrystalline electrodeposited Ni: Microstructure and tensile properties. Acta Mater. 50, 3957 (2002).
K. Noguchi, M. Araki, and Y. Ohno: The preparation of transmission electron microscopy specimens of as-drawn gold wire. Scripta Mater. 43, 199 (2000).
K.S. Kim, J.Y. Song, E.K. Chung, J.K. Park, and S.H. Hong: Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires. Mech. Mater. 38, 119 (2006).
Y.M. Wang and E. Ma: Strain hardening, strain rate sensitivity, and ductility of nanostructured metals. Mater. Sci. Eng., A 375–377, 46 (2004).
G.E. Dieter: Mechanical Metallurgy, 3rd ed. (McGraw-Hill, Boston, 1986).
R.W. Hayes, D. Witkin, F. Zhou, and E.J. Lavernia: Deformation and activation volumes of cryomilled ultrafine-grained aluminium. Acta Mater. 52, 4259 (2004).
H. Conrad and J. Narayan: Mechanisms for grain size hardening and softening in Zn. Acta Mater. 50, 5067 (2002).
Binary Alloy Phase Diagram, edited by T.B. Massalski (American Society for Metals, Metal Park, OH, 1986).
W.M. Yin, S.H. Whang, and R.A. Mirshams: Effect of interstitial on tensile strength and creep in nanostructured Ni. Acta Mater. 53, 383 (2005).
F. Liu and R. Kirchheim: Nano-scale grain growth inhibited by reducing grain boundary energy through solute segregation. J. Cryst. Growth 264, 385 (2004).
D. Hull and D.J. Bacon: Introduction to Dislocations, 4th ed. (Butterworth-Heinemann, Oxford, UK, 2001).
X. Zhang, R. Wang, and C.C. Koch: Mechanical behaviour of bulk ultrafine-grained and nanocrystalline Zn. Mater. Sci. 6, 53 (2004).
Kulicke & Soffa: Internal report (Kulicke & Soffa [S.E.A.], Singapore, 2004).
R.E. Reed-Hill: Physical Metallurgy Principle, 2nd ed. (D. Van Nostrand Company, New York, 1973).
R.D. Emery and G.L. Povirk: Tensile behavior of free-standing gold films. Part II. Fine-grained films. Acta Mater. 51, 2079 (2003).
R.Z. Valiev: Structure and mechanical properties of ultrafine-grained metals. Mater. Sci. Eng., A 234-236, 59 (1997).
G. Herklotz, L. Schrapler, C. Simons, J. Reuel, and Y.C. Cho: U.S. Patent No. 6,242,106 B1, June 5, 2001.
N. Hosoda, M. Tanaka, and T. Mori: U.S. Patent No. 4,885,135, January 9, 1989.
D.A. Porter and K.E. Easterling: Phase Transformations in Metals and Alloys, 2nd ed. (Chapman & Hall, London, 1991).
Chemistry CRC Handbook of 1999-2000 Physics A Ready-Reference Book of Chemical and Physical Data, 81st ed., edited by J.A. Kerr and D.R. Lide (CRC Press, Boca Raton, FL, 2000).
Y.H. Chew, C.C. Wong, C.D. Breach, F. Wulff, T.T. Lin, and C.B. He: Effects of Ca on grain-boundary cohesion in Au ball-bonding wire. Thin Solid Films 5.4, 346 (2006).
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Chew, Y.H., Wong, C.C., Breach, C.D. et al. Doping-induced simultaneous improvement of strength and ductility in ultrafine grained gold wires. Journal of Materials Research 21, 2345–2353 (2006). https://doi.org/10.1557/jmr.2006.0282
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DOI: https://doi.org/10.1557/jmr.2006.0282