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Utility of dodecyl sulfate surfactants as dissolution inhibitors in chemical mechanical planarization of copper

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Abstract

An important component of the slurries used in chemical mechanical planarization (CMP) is an appropriately chosen corrosion/dissolution inhibitor, which facilitates selective material removal from protrusions while protecting recessed regions of the surface. The present work demonstrates the utility of two environmentally benign anionic surfactants, sodium dodecyl sulfate (SDS) and ammonium dodecyl sulfate (ADS) as dissolution inhibitors. Using a standard slurry (1 wt% glycine with 5 wt% H2O2 at pH = 4.0) typically used for Cu CMP and combining measurements of open circuit potentials and contact angles with those of Cu removal rates, we show that both SDS and ADS suppress chemical dissolution and polish rates of Cu. The dissolution inhibition efficiencies of ADS and SDS measured in these experiments are found to be superior to those of benzotriazole (BTA), a traditional inhibiting agent used for copper CMP.

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Authors and Affiliations

  1. Interdisciplinary Engineering Science, Clarkson University, Potsdam, New York, 13699-5665, USA

    Y. Hong

  2. Department of Chemical Engineering, Clarkson University, Potsdam, New York, 13699-6650, USA

    U. B. Patri & S. Ramakrishnan

  3. Department of Physics, Clarkson University, Potsdam, New York, 13699-5820, USA

    D. Roy

  4. Center for Advanced Materials Processing, Clarkson University, Potsdam, New York, 13699-5665, USA

    S. V. Babu

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  1. Y. Hong
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  2. U. B. Patri
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  3. S. Ramakrishnan
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  4. D. Roy
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  5. S. V. Babu
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Correspondence to S. V. Babu.

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A preliminary report appears in Ref. 23.

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Hong, Y., Patri, U.B., Ramakrishnan, S. et al. Utility of dodecyl sulfate surfactants as dissolution inhibitors in chemical mechanical planarization of copper. Journal of Materials Research 20, 3413–3414 (2005). https://doi.org/10.1557/jmr.2005.0419

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  • DOI: https://doi.org/10.1557/jmr.2005.0419

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