Skip to main content
SpringerLink
Log in

Material Removal Simulation in Sawing Processes of Photovoltaic Silicon

  • Articles
  • Published:
MRS Advances Aims and scope Submit manuscript

Abstract

The wafering of thin silicon substrates is done by wire sawing technology. In this work a numerical model for the investigation of microstructural mechanisms like cracking and damage evolution during the sawing process is presented. A three-dimensional finite element model representing the phase transformation properties of silicon is validated by loading curves from nano-indentation experiments. By using cohesive zone finite elements, the crack lengths as well as crack initiation depths can be quantified and compared with the experimental results in terms of the maximum depth of subsurface damage.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. H. J. Moeller, C. Funke, M. Rinio, S. Scholz, Thin Solid Films 487, 179–187 (2005).

    Article  CAS  Google Scholar 

  2. International Technology Roadmap for Photovoltaic (ITRPV) Ninth Edition 2018: 2017 Results, Available at: http://www.itrpv.net/Reports/Downloads/ (accessed 08 November 2018).

  3. R. F. Cook, G. M. Pharr, J. Am. Ceram. Soc. 73 (4), 787–817 (1990).

    Article  CAS  Google Scholar 

  4. V. Domnich, Y. Gogotsi, Rev. Adv. Mater. Sci. 3, 1–36 (2002).

    Article  CAS  Google Scholar 

  5. K. E. Petersen, Proc. of the IEEE 70 (5), 420–457 (1982).

    Article  CAS  Google Scholar 

  6. J. Hu, L. Merkle, C. Menoni, I. Spain, Phys. Rev. B 34 (7), 4679–4684 (1986).

    Article  CAS  Google Scholar 

  7. R. G. Hennig, A. Wadehra, K. P. Driver, W. D. Parker, C. J. Umrigar, J. W. Wilkins, Phys. Rev. B 82 (1), 014101 (2010).

    Article  Google Scholar 

  8. M. Budnitzki, M. Kuna, Int. J. Solids Struct. 106–107, 294–304 (2017).

    Article  Google Scholar 

  9. A. P. Gerk, D. Tabor, Nature 271 (5647), 732–733 (1978).

    Article  CAS  Google Scholar 

  10. M. Budnitzki, M. Kuna, J. Mech. Phys. Solids 95, 64–91 (2016).

    Article  CAS  Google Scholar 

  11. J. J. Hall, Phys. Rev. 161 (3), 756–761 (1967).

    Article  CAS  Google Scholar 

  12. A. Mujica, A. Rubio, A. Munoz, R. J. Needs, Rev. Mod. Phys. 75 (3), 863–912 (2003).

    Article  CAS  Google Scholar 

  13. C. Bierwisch, B. Weber, R. Kuebler, M. Moseler, G. Kleer. Proc. of the 23rd European photovoltaic solar energy conference and exhibition, 1104–1108 (2008).

  14. C. Bierwisch, R. Kuebler, G. Kleer, M. Moseler, Philos. Trans. R. Soc. A 369 (1945), 2422–2430 (2011).

    Article  CAS  Google Scholar 

  15. T. Wagner, H. J. Moeller, Proc. of the 23rd European photovoltaic solar energy conference and exhibition, 1315–1320 (2008).

  16. T. Liedke, M. Kuna, Wear 304 (1–2), 77–82 (2013).

    Article  CAS  Google Scholar 

  17. T. Liedke, M. Kuna, Int. J. Mach. Tool Manufact. 51 (9), 711–720 (2011).

    Article  Google Scholar 

  18. B. Nassauer, A. Hess, M. Kuna, Int. J. Solids. Struct. 51 (14), 2656–2665 (2014).

    Article  Google Scholar 

  19. H. Wu, S. N. Melkote, J. Eng. Mater. Technol. 134 (4), 041011 (2012).

    Article  Google Scholar 

  20. B. Nassauer, M. Kuna, Comp. Part. Mech. 2, 63–71 (2015).

    Article  Google Scholar 

  21. F. Ebrahimi, L. Kalwani, Mater. Sci. Eng. A 268 (1–2), 116–126 (1999).

    Article  Google Scholar 

  22. F. Rickhey, J. H. Lee, H. Lee, J. Mat. Des. 107, 393–405 (2016).

    Google Scholar 

  23. J. H. Lee, Y. F. Gao, K. E. Johanns, G. M. Pharr, Acta Mater. 60, 5448–5467 (2012).

    Article  CAS  Google Scholar 

  24. W. C. Oliver, G. M. Pharr, J. Mater. Res. 7 (6), 1564–1583 (1992).

    Article  CAS  Google Scholar 

  25. F. Secco d’ Aragona, J. Electrochem. Soc. 119, 948–951 (1972).

    Article  Google Scholar 

  26. H. Olijnyk, S. K. Sikka, W. B. Holzapfel, Phys. Lett. A 103 (3), 137–140 (1984).

    Article  Google Scholar 

  27. M. T. Yin, M. L. Cohen, Phys. Rev. B 26 (10), 5668 (1982).

    Article  CAS  Google Scholar 

  28. M. A. Hopcroft, W. D. Nix, T. W. Kenny, J. Microelectromech. Syst. 19 (2), 229–238 (2010).

    Article  CAS  Google Scholar 

  29. K. Meyer, Master’s Thesis, TU Clausthal, 2015.

Download references

Author information

Authors and Affiliations

  1. Faculty of Mechanical and Energy Engineering, Leipzig University of Applied Sciences, Leipzig, Germany

    F. Wallburg & S. Schoenfelder

  2. Fraunhofer Center for Silicon Photovoltaics CSP, 06120, Halle (Saale), Germany

    F. Wallburg & S. Schoenfelder

  3. TU Bergakademie Freiberg, Institute of Mechanics and Fluid Dynamics, 09599, Freiberg, Germany

    F. Wallburg & M. Kuna

Authors
  1. F. Wallburg
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. M. Kuna
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. S. Schoenfelder
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Wallburg, F., Kuna, M. & Schoenfelder, S. Material Removal Simulation in Sawing Processes of Photovoltaic Silicon. MRS Advances 4, 761–768 (2019). https://doi.org/10.1557/adv.2019.95

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/adv.2019.95

Search

Navigation