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Enhanced Nanoparticle Removal Using Surfactants

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Abstract

Nanoparticles are used in chemical mechanical planarization for semiconductor manufacturing as well as in other precision manufacturing operations. Particles used in processing need to be removed from surfaces in order to enhance yields. Nanoparticles are difficult to remove from surfaces during cleaning due to the high van der Waals attractive forces between particles and surfaces relative to the low fluid drag forces that are used for typical removal methods. Ionic surfactant molecules can adsorb on particles and surfaces to create an electrostatic repulsion between particles and surfaces as well as provide a steric barrier to mitigate adsorption and adhesion. The effectiveness of the surfactant in enhancing particle removal is related to surfactant properties, and it can be correlated with and modeled relative to the critical micelle concentration of the surfactant. The general approach for modeling will be discussed, and the model will be compared with particle removal data.

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Authors and Affiliations

  1. University of Utah Department of Metallurgical Engineering, 135 S. 1460 E., Salt Lake City, 84112, UT, USA

    Michael L. Free

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  1. Michael L. Free
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Free, M.L. Enhanced Nanoparticle Removal Using Surfactants. MRS Advances 1, 2213–2224 (2016). https://doi.org/10.1557/adv.2016.294

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  • DOI: https://doi.org/10.1557/adv.2016.294

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