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Excimer Laser Drill for Multilayer Printed Circuit Boards: From Advanced Development to Factory Floor

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References

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  4. D.W. Korf, Electronic Packaging & Production, Feb. 1987, p. 56.

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  1. Central Department for Production and Logistics, Siemens AG, Otto-Hahn-Ring 6, D-8000, München 83, West Germany

    Friedrich Bachmann

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  1. Friedrich Bachmann
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Bachmann, F. Excimer Laser Drill for Multilayer Printed Circuit Boards: From Advanced Development to Factory Floor. MRS Bulletin 14, 49–53 (1989). https://doi.org/10.1557/S088376940006098X

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  • DOI: https://doi.org/10.1557/S088376940006098X

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